AMAT Applied Materials 0190-26769量规传感器

1.产 品 资 料 介 绍：

AMAT Applied Materials 0190-26769 量规传感器

核心功能

• 高精度测量：采用先进检测原理，实现纳米级或微米级测量精度
• 非接触式检测：避免对晶圆或精密部件表面造成物理损伤
• 实时数据输出：快速响应，支持高速数据采集与工艺闭环控制
• 宽测量范围：可适配不同厚度或距离的测量需求
• 高稳定性：工业级设计，适应半导体设备严苛工作环境

技术特点

• 测量原理：可能采用光学、电容或电感等先进检测技术
• 精度等级：纳米级分辨率，满足精密工艺要求
• 响应速度：微秒级响应，支持高速测量与控制
• 输出信号：模拟信号 (0-10V/4-20mA) 和 / 或数字信号
• 通信接口：可能支持 RS-485、Ethernet 等工业通信协议
• 安装方式：紧凑设计，适合设备内部狭小空间安装

典型应用

• 晶圆厚度与平整度测量
• 薄膜沉积厚度监控
• CMP (化学机械抛光) 终点检测
• 精密机械部件位置检测
• 设备对准与定位系统

AMAT Applied Materials 0190-26769量规传感器 英文资料：

AMAT Applied Materials 0190-26769 Gauge Sensor

AMAT 0190-26769 is a high-precision gauge sensor designed specifically for semiconductor manufacturing equipment, used for precise measurement of wafer thickness, thin film deposition thickness, or critical mechanical component position, ensuring process quality and equipment operation accuracy.

core functionality

High precision measurement: using advanced detection principles to achieve nanometer or micrometer level measurement accuracy

Non contact detection: avoid physical damage to the surface of wafers or precision components

Real time data output: fast response, supporting high-speed data acquisition and process closed-loop control

Wide measurement range: can adapt to measurement needs of different thicknesses or distances

High stability: Industrial grade design, suitable for harsh working environments of semiconductor equipment

Technical Features

Measurement principle: Advanced detection techniques such as optics, capacitance, or inductance may be used

Accuracy level: nanometer resolution, meeting precision process requirements

Response speed: microsecond level response, supporting high-speed measurement and control

Output signal: Analog signal (0-10V/4-20mA) and/or digital signal

Communication interface: may support industrial communication protocols such as RS-485 and Ethernet

Installation method: Compact design, suitable for installation in narrow spaces inside equipment

Typical Applications

Measurement of wafer thickness and flatness

Monitoring of Thin Film Deposition Thickness

CMP (chemical mechanical polishing) endpoint detection

Position detection of precision mechanical components

Equipment alignment and positioning system

AMAT Applied Materials  0190-26769量规传感器 产品展示      

 产品视频

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SC723A-001-PM72012	CACR-SR05SB1AF	61-0881-20
SC723A-001-PM72004	6SC6100-0GB02	7LA11
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218