AMAT Applied Materials 03-83191-00印刷电路板

AMAT Applied Materials   03-83191-00印刷电路板

1.产 品 资 料 介 绍：

• 高性能与高可靠性
  • 多层设计：可能采用多层结构，以提供更多的电路布线和连接，满足复杂电路的需求，提高信号传输的稳定性和抗干扰能力。
  • 高品质材料：通常会使用高品质的基材和导电材料，如具有高温耐受性的材料，确保在各种工作条件下的可靠性和稳定性，适应半导体制造等严格的工业环境。
• 良好的电气性能
  • 高密度布线：布线可能采用高密度设计，以节省空间并提高电路的性能，同时保证信号的准确传输，减少信号延迟和失真。
  • 精确的阻抗控制：如果该电路板用于高频或高速信号传输，可能会进行精确的阻抗控制，以确保信号的完整性，减少信号反射和衰减。
• 先进的制造工艺
  • 表面处理：可能进行了诸如金属化处理或阻焊处理等表面处理工艺，以保护线路免受氧化和物理损坏，提高电路板的耐久性和可焊性。
  • 精确制造：经过精确的制造和装配过程，确保良好的电气连接和可靠性，符合 AMAT 在半导体制造设备领域的高精度要求。
• 定制化设计
  • 尺寸和封装定制：根据具体应用需求，其尺寸和封装形式可能进行了定制，以适应不同的设备和安装要求，方便集成到各种复杂的系统中。

AMAT Applied Materials   03-83191-00印刷电路板 英文资料：

High performance and high reliability

Multi layer design: It may adopt a multi-layer structure to provide more circuit wiring and connections, meet the needs of complex circuits, and improve the stability and anti-interference ability of signal transmission.

High quality materials: High quality substrates and conductive materials are usually used, such as materials with high temperature resistance, to ensure reliability and stability under various working conditions and adapt to strict industrial environments such as semiconductor manufacturing.

Good electrical performance

High density wiring: Wiring may adopt high-density design to save space and improve circuit performance, while ensuring accurate signal transmission, reducing signal delay and distortion.

Accurate impedance control: If the circuit board is used for high-frequency or high-speed signal transmission, precise impedance control may be performed to ensure signal integrity, reduce signal reflection and attenuation.

Advanced manufacturing technology

Surface treatment: Surface treatment processes such as metallization or solder mask may be performed to protect the circuit from oxidation and physical damage, and improve the durability and solderability of the circuit board.

Precision manufacturing: Through precise manufacturing and assembly processes, ensure good electrical connections and reliability, meeting AMAT's high-precision requirements in the field of semiconductor manufacturing equipment.

customized design

Customization of size and packaging: Depending on specific application requirements, the size and packaging form may be customized to accommodate different devices and installation requirements, making it easy to integrate into various complex systems.

 AMAT Applied Materials  03-83191-00印刷电路板 产品展示      

 产品视频

3.其他产品

ABB TU846 终端单元
ABB  SPHSS13 伺服模块
ABB SM810K01 3BSE030928R1总线互连模块

4.其他英文产品

DSMC112 57360001-HC DCS system module
DSPC174 3BSE005461R1 Logic control card
DSRF180A 57310255-AV Control framework

The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218