Gasonics 95-4477剥离模块

Gasonics 95-4477剥离模块

1.产 品 资 料 介 绍：

Gasonics 95-4477 剥离模块是一种常用于半导体制造工艺中的等离子体剥离（Plasma Ashing）设备模块，属于Gasonics等离子体系统中的关键部件，主要用于去除光刻胶（photoresist）和其他有机残留物。

一、产品概述

Gasonics 95-4477剥离模块是Gasonics公司等离子体剥离设备中的核心功能部件，通常安装于等离子体反应腔（ash chamber）中，负责在等离子体环境下稳定进行灰化、清洗等操作。该模块具备耐高温、抗腐蚀、等离子均匀分布等特性。

二、应用领域

1. 半导体制造

   • 用于晶圆（wafer）加工过程中光刻胶的去除

   • 去除刻蚀残留物，清洁表面，确保下一步制程精度

2. 集成电路(IC)封装工艺

   • 去除IC封装前的有机残留，提升封装质量

3. 微机电系统（MEMS）制造

   • 在MEMS结构体释放过程中，使用剥离模块去除牺牲层材料

4. 平板显示器（FPD）制造

   • 清除显示面板光刻后的残胶，提高成品率

5. 太阳能电池制造

   • 对硅片表面进行灰化处理，改善后续金属化接触性能

6. 化合物半导体制造（如GaAs、SiC、GaN等）

   • 对材料表面进行有机层剥离，确保高质量的界面清洁度

英文资料：

The Gasonics 95-4477 stripping module is a plasma ashing equipment module commonly used in semiconductor manufacturing processes. It is a key component in Gasonics plasma systems and is mainly used to remove photoresists and other organic residues.

1、 Product Overview

The Gasonics 95-4477 stripping module is the core functional component of Gasonics' plasma stripping equipment, usually installed in the plasma reaction chamber (ash chamber), responsible for stable ashing, cleaning and other operations in the plasma environment. This module has characteristics such as high temperature resistance, corrosion resistance, and uniform distribution of plasma.

2、 Application Fields

Semiconductor Manufacturing

Used for removing photoresist during wafer processing

Remove etching residues, clean the surface, and ensure the accuracy of the next process step

Integrated Circuit (IC) Packaging Process

Removing organic residues before IC packaging to improve packaging quality

Manufacturing of Micro Electro Mechanical Systems (MEMS)

During the release process of MEMS structures, a stripping module is used to remove sacrificial layer materials

Flat Panel Display (FPD) Manufacturing

Remove residual adhesive from the display panel after photolithography to improve yield

Manufacturing of solar cells

Ashing treatment of silicon wafer surface to improve subsequent metallization contact performance

Compound semiconductor manufacturing (such as GaAs, SiC, GaN, etc.)

Peel off the organic layer on the surface of the material to ensure high-quality interface cleanliness

2.产      品      展      示      

3.其他产品

 61-0476-20 印刷电路板

BENTLY 3500/45 176449-04位置监测器

HONEYWELL 51107403-100 输入输出模块

4.其他英文产品

KOLLMORGEN 6SM37M-6000 servo motor

A-B 1794-IRT8XT Relay Output Module

A-B 1769-OF8C current module

The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218