1.产 品 资 料 介 绍：
YASKAWA XU-ACP130-B01 晶圆预对准器
YASKAWA XU-ACP130-B01 适配 300mm 硅片精准定位
真空吸附固定晶圆，不划伤片体边缘
红光 CCD 传感，快速识别晶圆缺口与平边
伺服直驱旋转，角度对准精度高
单次校准耗时短，提升产线流转效率
整机低粉尘材质，符合无尘车间洁净标准
内置真空检测，缺片自动触发报警
小型一体化机身，适配设备狭小安装位
支持硅片、石英片两种晶圆材质校准
20 位高精度编码器，旋转无定位偏差
稳定气压、真空供气适配，运行波动小
抗车间电磁干扰，数据传输稳定可靠
可联动机械手控制器，集成调试简便
全密封结构防尘防潮，长期耐用
出厂完成多点校准，现场无需反复调试
综上，YASKAWA XU-ACP130-B01 晶圆预对准器精度高、洁净耐用，是 300mm 半导体制程标准定位配件
YASKAWA XU-ACP130-B01晶圆预对准器 产品英文
YASKAWA XU-ACP130-B01 Wafer Pre Alignment Device
YASKAWA XU-ACP130-B01 is suitable for precise positioning of 300mm silicon wafers
Vacuum adsorption fixes the wafer without scratching the edges of the wafer
Red light CCD sensor for rapid identification of wafer notches and flat edges
Servo direct drive rotation, high angle alignment accuracy
Short single calibration time, improving production line circulation efficiency
The whole machine is made of low dust material and meets the cleanliness standards of dust-free workshops
Built in vacuum detection, automatic trigger alarm for missing chips
Small integrated body, suitable for devices with narrow installation positions
Support calibration of silicon wafer and quartz wafer materials
20 bit high-precision encoder with no positioning deviation during rotation
Stable air pressure, vacuum supply adaptation, and minimal operational fluctuations
Anti workshop electromagnetic interference, stable and reliable data transmission
Interlockable robotic arm controller, easy to integrate and debug
Fully sealed structure for dust and moisture prevention, long-lasting durability
Multiple point calibration is completed at the factory, eliminating the need for repeated on-site debugging
In summary, the YASKAWA XU-ACP130-B01 wafer pre aligner has high accuracy, cleanliness, and durability, making it a standard positioning accessory for 300mm semiconductor processes
YASKAWA XU-ACP130-B01晶圆预对准器 产品展示
视频展示
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
