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KLA-Tencor 770-809195-000图像处理器模块

发布时间:2025-05-21人气:
  • KLA-Tencor 770-809195-000图像处理器模块
  • KLA-Tencor 770-809195-000图像处理器模块
  • KLA-Tencor 770-809195-000图像处理器模块

  KLA-Tencor  770-809195-000图像处理器模块

1.产 品 资 料 介 绍:

中文资料:

一、基本信息

  • 产品型号:770-809195-000

  • 制造商:KLA-Tencor

  • 产品类型:图像处理器模块(Image Processor Module)

  • 主要用途:用于半导体检测设备中,对采集的图像数据进行高速处理和分析


二、功能描述

  • 实时高速图像数据处理

  • 支持复杂图像分析算法,如缺陷检测、图像增强、滤波等

  • 提供高带宽数据传输接口,保证图像处理效率

  • 与检测设备的其它模块协同工作,提升整体检测性能

  • 支持多种图像输入格式和接口标准


三、技术参数(参考)

  • 处理能力:高性能图像处理芯片,支持多线程并行计算

  • 接口类型:高速数据接口(如Camera Link、LVDS或专用总线接口)

  • 输入格式:多种数字图像格式支持

  • 工作电压:依据设备规格,一般为12V或24V DC

  • 工作温度范围:工业级温度适应,通常为0℃至+60℃或更广

  • 尺寸规格:符合设备内部安装要求,具体尺寸根据设备设计


四、应用领域

  • 半导体晶圆缺陷检测系统

  • 电子显微镜图像采集与处理

  • 精密光学检测设备

  • 其他需要高速图像处理的工业检测系统

英文资料:

1、 Basic Information

Product model: 770-809195-000


Manufacturer: KLA Tencor


Product type: Image Processor Module


Main purpose: Used in semiconductor testing equipment for high-speed processing and analysis of collected image data


2、 Function Description

Real time high-speed image data processing


Support complex image analysis algorithms such as defect detection, image enhancement, filtering, etc


Provide high bandwidth data transmission interface to ensure image processing efficiency


Collaborate with other modules of the detection equipment to improve overall detection performance


Supports multiple image input formats and interface standards


3、 Technical parameters (reference)

Processing capability: High performance image processing chip, supporting multi-threaded parallel computing


Interface type: High speed data interface (such as Camera Link, LVDS, or dedicated bus interface)


Input format: Multiple digital image formats supported


Working voltage: Depending on the equipment specifications, it is generally 12V or 24V DC


Working temperature range: industrial grade temperature adaptation, usually from 0 ℃ to+60 ℃ or wider


Size specifications: comply with the internal installation requirements of the equipment, and the specific size depends on the equipment design


4、 Application Fields

Semiconductor wafer defect detection system


Electron microscope image acquisition and processing


Precision optical testing equipment


Other industrial inspection systems that require high-speed image processing

2.产      品      展      示      

11799_kla-tencor_vip_image_processor_vme_tel_card_board_770-809195-000_5.jpg

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