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TEL Tokyo Electron BX80-000063-V1控制器机架

发布时间:2025-06-26人气:
  • TEL Tokyo Electron BX80-000063-V1控制器机架
  • TEL Tokyo Electron BX80-000063-V1控制器机架
  • TEL Tokyo Electron BX80-000063-V1控制器机架

TEL Tokyo Electron  BX80-000063-V1控制器机架

1.产 品 资 料 介 绍:

中文资料:

一、基本信息

  • 产品型号:BX80-000063-V1

  • 产品名称:控制器机架(Controller Rack / 控制架)

  • 制造商:Tokyo Electron Limited(TEL,日本东京电子)

  • 版本编号:V1(表示版本 1 或第一代结构版本)


二、产品定义与作用

该机架是 TEL 设备中用于安装、连接和整合多个控制模块、电路板、供电单元与通信接口的标准框架结构部件,是整个控制系统的物理与电气“骨架”。

功能类别描述
模块安装平台提供标准卡槽或托架,支持安装控制板、I/O 模块、电源模块等
电源分配内部可能集成背板电源总线,为各模块分配稳定供电
信号背板支持提供多通道信号总线或连接插槽,实现模块间通信连接
结构支撑确保电路板模块牢固固定于设备中,抗振防松
散热与屏蔽配合风道、导热片或金属外壳,确保运行温度与EMI屏蔽性能

三、典型应用场景

该机架通常应用于以下类型的 TEL 半导体设备控制系统中:

  • ACT 系列(光刻辅助处理设备)

  • Trias、Tactras 系列(CVD / Etch 设备)

  • 晶圆搬运系统(EFEM、Load Port、Transfer Module)

在上述设备中,该机架用于整合:

  • 主控制板(如 CPU 板、I/O 板)

  • 通信模块(如 RS-232/422/485、Ethernet、TEL bus)

  • 数字与模拟接口板

  • 电源模块(AC/DC、24V 电源等)

英文资料:

1、 Basic Information

Product model: BX80-000063-V1


Product Name: Controller Rack


Manufacturer: Tokyo Electron Limited (TEL, Tokyo Electronics, Japan)


Version number: V1 (representing version 1 or first generation structural version)


2、 Product Definition and Function

This rack is a standard framework structural component used in TEL equipment for installing, connecting, and integrating multiple control modules, circuit boards, power supply units, and communication interfaces. It is the physical and electrical "skeleton" of the entire control system.


Functional category description

The module installation platform provides standard card slots or brackets, supporting the installation of control boards, I/O modules, power modules, etc

The internal power distribution may integrate a backplane power bus to provide stable power supply for each module

The signal backplane supports providing multi-channel signal buses or connection slots to achieve communication connections between modules

Structural support ensures that the circuit board module is firmly fixed in the equipment, anti vibration and anti loosening

Heat dissipation and shielding are combined with air ducts, thermal conductive sheets, or metal shells to ensure operating temperature and EMI shielding performance


3、 Typical application scenarios

This rack is typically used in TEL semiconductor equipment control systems of the following types:


ACT series (photolithography auxiliary processing equipment)


Trias, Tactras series (CVD/Etch equipment)


Wafer Handling System (EFEM, Load Port, Transfer Module)


In the above equipment, this rack is used for integrating:


Main control board (such as CPU board, I/O board)


Communication modules (such as RS-232/422/485, Ethernet, TEL bus)


Digital and Analog Interface Board


Power module (AC/DC, 24V power supply, etc.)

2.产      品      展      示      

tel_tokyo_electron_bx80-000063-v1_ecc2_controller_mc_rack_module_1.jpg

3.其他产品

Areva  MVAX31S1DE0754A 监视继电器模块

 EPC-26A中央控制器模块

 61-0881-10单板计算机

4.其他英文产品

DELTA TAU ACC-24E2 interface simulation

ALSTOM 3EST125-975 DCC2382A Control Pane

Asea 2668-184-280 12 slot control board

SRF3756-4996-84-5-56BC-CUSC403044T3SC942-001-01
SRF3752-4984-84-5-56BC-CUSC402-001-T2SC753B-001-02
SRF3736-4983-84-7-56HC-CUSC403-013-T3SC755A-001-01
SRF3736-4983-84-5-56BC-CUSC403-001-T5SC754A-001-02
SRF3650-4823-84-5-56BC-CUSC402-003-T3SC903NN-001-01
SRF3643-4593-7-56CSC403-001-T2SC755A-040-08
SRF3643-4593-7-5-56CSC403-002-T2SC754B-001-01

The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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