TEL Tokyo Electron 2L81-050035-11接口模块
1.产 品 资 料 介 绍：
TEL Tokyo Electron 2L81-050035-11 接口模块简介
产品型号： 2L81-050035-11
产品名称： 接口模块（Interface Module）
制造商： Tokyo Electron Ltd.（TEL）
适用设备： 用于TEL的半导体制造设备，如CVD、Etcher、Coater/Developer等系统中
一、核心功能
信号转接与中继
用于连接设备内部各功能模块，如控制板、I/O模块、传感器与执行器，完成信号中转、放大或匹配。通信适配
将不同通信协议或信号标准进行协调，如TTL与RS信号、电压电平匹配等。模块间联通桥梁
连接主控制系统与子系统，保证设备的模块化协同运行。电源或数据分配
分发低压电源（如+5V、+12V）或分配数字信号给多个子通道。
二、应用领域
工艺控制系统：在反应腔体温控、气体控制、泵阀控制等模块中充当控制信号桥梁。
I/O中转中心：将来自现场设备的数字/模拟信号转发至主控制单元。
通信接口扩展：用于扩展TEL设备的数据通信能力，支持多通道、多协议连接。
系统级信号集成：将多个子模块集中统一接入系统主干结构，方便调试与维护。
三、产品特点（基于TEL接口模块通用设计）
高信号完整性、抗干扰能力强
模块化标准尺寸，兼容TEL专用背板或机架系统
多针接口或排线连接，支持快速插拔
工业等级设计，适用于洁净室和高可靠性环境
支持热插拔维护，易于更换
英文资料：
Introduction to TEL Tokyo Electron 2L81-050035-11 Interface Module
Product model: 2L81-050035-11
Product Name: Interface Module
Manufacturer: Tokyo Electron Ltd. (TEL)
Applicable equipment: Used in semiconductor manufacturing equipment for TEL, such as CVD, Etcher, Coater/Developer systems, etc
1、 Core functions
Signal transfer and relay
Used to connect various functional modules within the device, such as control boards, I/O modules, sensors, and actuators, to complete signal transfer, amplification, or matching.
Communication adaptation
Coordinate different communication protocols or signal standards, such as TTL and RS signals, voltage level matching, etc.
Connecting bridges between modules
Connect the main control system and subsystems to ensure modular and collaborative operation of the equipment.
Power or data distribution
Distribute low-voltage power supplies (such as+5V,+12V) or distribute digital signals to multiple sub channels.
2、 Application Fields
Process control system: acts as a control signal bridge in modules such as reaction chamber temperature control, gas control, pump valve control, etc.
I/O relay center: forwards digital/analog signals from on-site devices to the main control unit.
Communication interface extension: used to expand the data communication capabilities of TEL devices, supporting multi-channel and multi protocol connections.
System level signal integration: Centralize and unify multiple sub modules into the system backbone structure for easy debugging and maintenance.
3、 Product features (based on universal design of TEL interface module)
High signal integrity and strong anti-interference ability
Modular standard size, compatible with TEL dedicated backplane or rack systems
Multi pin interface or ribbon cable connection, supporting quick plugging and unplugging
Industrial grade design, suitable for clean rooms and high reliability environments
Support hot swappable maintenance, easy to ｒｅｐｌａｃｅ
2.产 品 展 示
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