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Tokyo Electron 3M87-021335冷却器组件

发布时间:2025-07-11人气:
  • Tokyo Electron 3M87-021335冷却器组件
  • Tokyo Electron 3M87-021335冷却器组件
  • Tokyo Electron 3M87-021335冷却器组件

TEL Tokyo Electron  3M87-021335冷却器组件

1.产 品 资 料 介 绍:

产品名称:

Tokyo Electron 3M87-021335 冷却器组件(Chiller Unit / Cooler Assembly) 是一款用于 TEL 半导体设备中的温度控制部件,主要功能是在复杂工艺过程中对关键部件如腔体、电源模块、工艺气体或液体流通系统进行精准的冷却管理,确保设备运行的热稳定性和工艺一致性。


一、产品功能概述

  • 类型:冷却器组件 / 液冷系统子单元

  • 主要功能

    • 为腔体、RF 模块、光源、加热平台等关键单元提供冷却;

    • 保持系统温度在设定范围内,防止过热;

    • 支持温度反馈控制和多级冷却液流速调节。


二、典型应用领域

1. 蚀刻设备(Etch Systems)

  • 冷却反应腔体壁面,控制等离子体环境温度;

  • 抑制微粒生成,提高蚀刻精度。

2. CVD / ALD 沉积设备

  • 稳定反应室及 precursor 输送系统温度,避免材料结晶或沉积缺陷;

  • 控制温度梯度以保障膜层均匀性。

3. 显影 / 清洗模块

  • 为显影液、去胶液、DI 水等液体冷却循环系统提供支持;

  • 保证化学反应在合适温度下进行,提高清洗效果。

4. RF 电源和激光光源冷却

  • 防止射频匹配器、激光组件等电子设备过热;

  • 延长关键电子元件的使用寿命。

英文资料:

The Tokyo Electron 3M87-021335 Chiller Unit/Cooler Assembly is a temperature control component used in TEL semiconductor equipment. Its main function is to accurately cool and manage critical components such as chambers, power modules, process gas or liquid circulation systems during complex processes, ensuring the thermal stability and process consistency of equipment operation.


1、 Product Function Overview

Type: Cooler component/Liquid cooling system subunit


Main functions:


Provide cooling for key units such as cavities, RF modules, light sources, heating platforms, etc;


Maintain the system temperature within the set range to prevent overheating;


Support temperature feedback control and multi-stage coolant flow rate adjustment.


2、 Typical application areas

Etch Systems etching equipment

Cooling the wall of the reaction chamber and controlling the temperature of the plasma environment;


Inhibit particle generation and improve etching accuracy.


2. CVD/ALD deposition equipment

Stabilize the temperature of the reaction chamber and precursor transport system to avoid material crystallization or deposition defects;


Control the temperature gradient to ensure the uniformity of the film layer.


3. Development/cleaning module

Provide support for liquid cooling and circulation systems such as developing solution, de sizing solution, DI water, etc;


Ensure that chemical reactions occur at appropriate temperatures to improve cleaning effectiveness.


4. RF power supply and laser light source cooling

Prevent overheating of electronic devices such as RF adapters and laser components;


Extend the lifespan of critical electronic components.

2.产      品      展      示      

tokyo_tel_3m87-021335_rev_17_unity_ii_cooling_chamber_with_30_day_warranty_5.jpg

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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