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AMAT Applied Materials 0010-26057晶圆升降组件

发布时间:2025-10-14人气:
  • AMAT Applied Materials 0010-26057晶圆升降组件
  • AMAT Applied Materials 0010-26057晶圆升降组件
  • AMAT Applied Materials 0010-26057晶圆升降组件

AMAT Applied Materials  0010-26057晶圆升降组件

1.产 品 资 料 介 绍:

1. 适配场景与功能(0010-26057)
  • 设备适配:匹配 AMAT CVD/PVD/ 蚀刻机台(如 Producer、Endura 系列),可接入原有自动化系统,无需改协议。
  • 晶圆兼容:主打 300mm 晶圆,换氧化铝陶瓷托盘(Ra≤0.2μm)可兼容 200mm,防划伤薄膜。
  • 核心功能:负责晶圆在腔室间升降转运,确保与腔室部件同轴度误差≤0.1mm,保障工艺均匀性。
2. 精度与性能(0010-26057)
  • 定位精度:亚微米级闭环控制,光栅尺(0.1μm)+ 伺服电机(0.8N・m),误差 ±0.5μm,适配 3x 纳米制程。
  • 运行稳定:谐波减速器(≤1 弧分)消间隙,升降速度 0.5-5mm/s 可调,接近部件时自动低速(0.5mm/s)。
  • 环境适应:真空兼容(漏率≤1×10⁻⁹ Pa・m³/s,1×10⁻³ - 1×10⁻⁷ Pa 可用),Y₂O₃涂层抗等离子腐蚀,寿命超 10000 小时。
3. 结构与防护(0010-26057)
  • 模块化:分驱动 / 承载 / 检测单元,标准化接口,单独更换≤30 分钟,降停机成本。
  • 晶圆防护:三点柔性支撑(接触 0.5mm²)减污染,聚氨酯缓冲(50 Shore A,行程 2mm)防碎裂。
  • 清洁适配:无死角结构 + 钝化处理(耐蚀≥9 级),兼容 IPA、氨水清洁,支持在线维护。

AMAT Applied Materials  0010-26057晶圆升降组件  英文资料:

1. Adaptation scenarios and functions (0010-26057)

Equipment adaptation: Matching AMAT CVD/PVD/etching machines (such as Producer, Endura series), can be integrated into existing automation systems without changing protocols.

Wafer compatibility: Mainly designed for 300mm wafers, compatible with 200mm and scratch resistant film on aluminum oxide ceramic trays (Ra ≤ 0.2 μ m).

Core function: Responsible for lifting and transporting wafers between chambers, ensuring coaxiality error with chamber components is ≤ 0.1mm, and ensuring process uniformity.

2. Accuracy and Performance (0010-26057)

Positioning accuracy: sub micron level closed-loop control, grating ruler (0.1 μ m)+servo motor (0.8N · m), error ± 0.5 μ m, suitable for 3x nanometer process.

Stable operation: Harmonic reducer (≤ 1 arc minute) eliminates clearance, adjustable lifting speed of 0.5-5mm/s, and automatically slows down (0.5mm/s) when approaching components.

Environmental adaptation: Vacuum compatible (leakage rate ≤ 1 × 10 ⁻⁹ Pa · m ³/s, 1 × 10 ⁻³ -1 × 10 ⁻⁷ Pa available), Y ₂ O3 coating resistant to plasma corrosion, with a lifespan of over 10000 hours.

3. Structure and Protection (0010-26057)

Modularization: divided into drive/load/detection units, standardized interfaces, individual replacement ≤ 30 minutes, reducing downtime costs.

Wafer protection: Three point flexible support (contact 0.5mm ²) reduces pollution, polyurethane buffer (50 Shore A, stroke 2mm) prevents breakage.

Cleaning adaptation: no dead corner structure+passivation treatment (corrosion resistance ≥ 9 levels), compatible with IPA and ammonia cleaning, supports online maintenance.

AMAT Applied Materials 0010-26057晶圆升降组件 产品展示      

applied_materials_0010-26057_idc_pt-app001_asp_wafer_lift_assy_amat.jpg


 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218 

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