7221-272.0000印刷电路板

7221-272.0000印刷电路板 

1.产 品 资 料 介 绍：

7221-272.0000印刷电路板产品特点

1. 采用高品质FR-4基材，玻璃化温度（Tg）≥130℃，具备优异的耐高温与力学稳定性，适配工业复杂环境。

2. 多层布线结构设计，布线密度高，可在有限空间内实现多元器件高效互连，支撑复杂电路功能实现。

3. 高精度线路制作工艺，最小线宽/间距达3.0mil，信号传输路径精准，保障电路信号完整性。

4. 采用化学沉金表面处理工艺，触点抗氧化、耐腐蚀性能优异，延长产品使用寿命与连接可靠性。

5. 独立电源层与接地层设计，有效降低信号串扰与电磁干扰，提升电路工作稳定性。

6. 金属化孔工艺成熟，孔壁镀铜均匀，导通性能优异，层间信号传输损耗低。

7. 严格控制阻抗特性，阻抗公差≤±10%，适配高频信号传输场景，满足高速电路工作需求。

8. 具备优异的机械加工精度，X/Y/Z轴加工误差≤±0.03mm，螺丝孔、定位孔精准，便于装配。

9. 采用对称压合工艺，板材平整度高，不易翘曲变形，保障元器件贴片精度与装配稳定性。

10. 符合RoHS环保标准，采用无卤素材料与环保工艺，满足绿色生产与应用要求。

11. 经过严格的环境可靠性测试，具备良好的抗潮湿、抗振动性能，适应恶劣工业工况。

12. 兼容自动化贴片与焊接工艺，可实现大批量标准化生产，保障产品一致性与生产效率。

13. 板边采用圆角处理，无锋利边缘，装配过程中可避免人员划伤与元器件损伤。

14. 预留充足的测试点，便于生产过程中的性能检测与后期故障排查，降低维护成本。

15. 广泛应用于工业控制、通信设备、仪器仪表等领域，作为核心电路载体支撑设备稳定运行。

7221-272.0000印刷电路板 英文资料：

7221-272.0000 Printed Circuit Board Product Features

1. Using high-quality FR-4 substrate with a glass transition temperature (Tg) ≥ 130 ℃, it has excellent high temperature resistance and mechanical stability, and is suitable for complex industrial environments.

2. Multi layer wiring structure design, high wiring density, can achieve efficient interconnection of multiple devices in limited space, supporting the implementation of complex circuit functions.

3. High precision circuit manufacturing process, with a minimum line width/spacing of 3.0mil, precise signal transmission path, ensuring circuit signal integrity.

4. Adopting chemical immersion gold surface treatment process, the contact has excellent oxidation resistance and corrosion resistance, extending the product's service life and connection reliability.

5. The design of independent power and ground layers effectively reduces signal crosstalk and electromagnetic interference, and improves the stability of circuit operation.

6. The metalized hole process is mature, the copper plating on the hole wall is uniform, the conductivity is excellent, and the interlayer signal transmission loss is low.

7. Strictly control the impedance characteristics, with an impedance tolerance of ≤± 10%, suitable for high-frequency signal transmission scenarios, and meet the requirements of high-speed circuit operation.

8. It has excellent mechanical processing accuracy, with X/Y/Z axis processing error of ≤± 0.03mm, precise screw holes and positioning holes, and easy assembly.

9. Adopting symmetrical pressing technology, the flatness of the board is high, and it is not easy to warp or deform, ensuring the precision of component placement and assembly stability.

10. Compliant with RoHS environmental standards, using halogen-free materials and environmentally friendly processes to meet green production and application requirements.

11. After rigorous environmental reliability testing, it has good resistance to moisture and vibration, and is suitable for harsh industrial conditions.

12. Compatible with automated SMT and soldering processes, it can achieve large-scale standardized production, ensuring product consistency and production efficiency.

13. The board edge is rounded with no sharp edges, which can avoid personnel scratches and component damage during assembly.

14. Reserve sufficient testing points for performance testing and later troubleshooting during the production process, reducing maintenance costs.

15. Widely used in industrial control, communication equipment, instrumentation and other fields, as the core circuit carrier to support the stable operation of equipment.

7221-272.0000印刷电路板 产品展示

产品视频

3.其他产品

Rockwell 1771-NIV模拟输入/输出（I/O）模块
ABB RCU501遥控单元
Advantest BGR-022365 A000824B-DED控制模块

4.其他英文产品

METSO D100644 Embedded module
NOVOTRON ND32-5610 ND32-5610VS-101-011-31 module
ABB 3BHE039203R0101 GVC736CE101 control card

The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218