0702-B001645印刷电路板

0702-B001645印刷电路板 

1.产 品 资 料 介 绍：

0702-B001645印刷电路板产品特点

1. 采用高品质FR-4基材，玻璃化温度（Tg）≥170℃，具备优异的耐高温性与力学稳定性，适配工业高温工况。

2. 采用高多层布线结构设计，结合HDI高密度互连技术，布线密度高，可在有限空间内实现复杂电路功能集成。

3. 高精度线路制作工艺，最小线宽/间距达0.1mm，信号传输路径精准，保障高速信号传输的完整性。

4. 采用化学沉金表面处理工艺，触点抗氧化、耐腐蚀性能优异，存储寿命超12个月，焊接可靠性高。

5. 独立电源层与接地层设计，配合阻抗控制技术，阻抗公差≤±10%，有效降低信号串扰与电磁干扰。

6. 采用激光微孔技术，微孔孔径≤0.1mm，结合盲埋孔工艺，提升层间互连效率，减少信号传输损耗。

7. 金属化孔工艺成熟，孔壁镀铜均匀且厚度≥25μm，导通性能优异，层间信号传输稳定可靠。

8. 严格的机械加工精度控制，外形加工公差≤±0.2mm，定位孔精准，保障元器件装配精度与稳定性。

9. 采用对称压合工艺，板材平整度高，翘曲度＜2%，避免因形变影响元器件贴片精度。

10. 符合RoHS 2.0环保标准，采用无卤材料与环保工艺，燃烧时无有毒气体释放，满足绿色生产要求。

11. 经过严苛的环境可靠性测试，具备良好的抗潮湿、抗振动性能，适应工业复杂恶劣工况。

12. 兼容自动化贴片与焊接工艺，可实现大批量标准化生产，保障产品一致性与生产效率。

13. 板边采用圆角倒角处理，无锋利边缘，装配过程中可避免人员划伤与元器件损伤。

14. 预留充足的测试点与调试接口，便于生产过程中的性能检测与后期故障排查，降低维护成本。

15. 广泛应用于工业控制、汽车电子、智能测控等领域，作为核心电路载体支撑设备长期稳定运行。

0702-B001645印刷电路板 英文资料：

0702-B001645 Printed Circuit Board Product Features

1. Using high-quality FR-4 substrate with a glass transition temperature (Tg) ≥ 170 ℃, it has excellent high temperature resistance and mechanical stability, and is suitable for industrial high temperature working conditions.

2. Adopting a multi-layer wiring structure design, combined with HDI high-density interconnect technology, the wiring density is high, and complex circuit function integration can be achieved in a limited space.

3. High precision circuit manufacturing process, with a minimum line width/spacing of 0.1mm, precise signal transmission path, ensuring the integrity of high-speed signal transmission.

4. Adopting chemical immersion gold surface treatment process, the contact has excellent oxidation resistance and corrosion resistance, with a storage life of over 12 months and high welding reliability.

5. Independent power layer and ground layer design, combined with impedance control technology, with impedance tolerance of ≤± 10%, effectively reducing signal crosstalk and electromagnetic interference.

6. Adopting laser micro hole technology with a micro hole diameter of ≤ 0.1mm, combined with blind buried hole technology, to improve interlayer interconnection efficiency and reduce signal transmission loss.

7. The metalized hole process is mature, with uniform copper plating on the hole wall and a thickness of ≥ 25 μ m, excellent conductivity, and stable and reliable interlayer signal transmission.

8. Strict mechanical processing accuracy control, with an external processing tolerance of ≤± 0.2mm and precise positioning holes to ensure the accuracy and stability of component assembly.

9. Adopting symmetrical pressing technology, the flatness of the board is high, and the warpage is less than 2%, avoiding the influence of deformation on the precision of component placement.

10. Compliant with RoHS 2.0 environmental standards, using halogen-free materials and environmentally friendly processes, with no toxic gas release during combustion, meeting the requirements of green production.

11. After rigorous environmental reliability testing, it has good resistance to moisture and vibration, and is suitable for complex and harsh industrial working conditions.

12. Compatible with automated SMT and soldering processes, it can achieve large-scale standardized production, ensuring product consistency and production efficiency.

13. The board edge is processed with rounded corners and chamfers, without sharp edges, which can avoid personnel scratches and component damage during assembly.

14. Reserve sufficient testing points and debugging interfaces for performance testing and later troubleshooting during the production process, reducing maintenance costs.

15. Widely used in industrial control, automotive electronics, intelligent measurement and control, etc., as the core circuit carrier to support the long-term stable operation of equipment.

0702-B001645印刷电路板 产品展示

产品视频

3.其他产品

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SYHNC100-NIB-23/W-24-P-D-E23-A012 R900978416 drive

The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218