1.产 品 资 料 介 绍：
Yaskawa XU-ACP130-B11 晶圆预对准器产品特点
开头
- 适配 12 寸标准晶圆，兼容各类带缺口硅片，通用性强
- 内置高精度伺服电机，旋转定位重复精度高，偏差极小
- 光学感应检测缺口，识别速度快，缩短单张晶圆处理时长
- 低摩擦承载台面，吸附平稳，转运过程无晶圆划伤
- 紧凑型轻量化机身，整机体积小，节省设备腔室安装空间
- 支持 EtherCAT、RS232 工业通讯，可无缝对接设备主控系统
- 闭环位置反馈控制，实时修正偏移，杜绝对位异常报错
- 洁净级无尘设计，无粉尘掉落，保障晶圆生产良率
- 多重硬件安全防护，搭配急停回路，防止撞片损坏晶圆
- 宽温稳定运行，车间高低温环境下对位性能不衰减
- 抗震动加固结构，机械手转运抖动不影响检测精度
- 可视化故障自检，实时反馈感应、伺服、吸附异常信号
- 模块化拆装结构，核心组件单独拆卸，维修更换省时
- 低噪平稳运转，启停缓冲控制，无冲击损伤晶圆边缘
- 符合半导体 RoHS 洁净环保标准，适配高端产线合规要求
结尾
Yaskawa XU-ACP130-B11晶圆预对准器 产品英文
Yaskawa XU-ACP130-B11 wafer pre aligner product features
beginning
Yaskawa XU-ACP130-B11 is a specialized wafer pre aligner for 300mm semiconductor equipment. With the high-precision drive of Yaskawa servo, it quickly completes wafer notch positioning and is suitable for continuous production of lithography, etching, and thin film machines.
Compatible with 12 inch standard wafers, compatible with various types of silicon wafers with notches, and highly versatile
Built in high-precision servo motor, with high repeatability and minimal deviation in rotational positioning
Optical sensing detects gaps, with fast recognition speed and reduced processing time for a single wafer
Low friction load-bearing platform, stable adsorption, and no wafer scratches during transportation
Compact and lightweight body, small overall size, saving installation space in equipment compartments
Supports EtherCAT and RS232 industrial communication, seamlessly integrates with device control systems
Closed loop position feedback control, real-time correction of offset, and elimination of abnormal alignment errors
Clean grade dust-free design, no dust falling, ensuring wafer production yield
Multiple hardware security protections, combined with an emergency stop circuit, prevent wafer damage caused by collision
Stable operation over a wide temperature range, with no degradation in alignment performance under high and low temperature environments in the workshop
Anti vibration reinforced structure, mechanical arm transportation shaking does not affect detection accuracy
Visual fault self inspection, real-time feedback of induction, servo, and adsorption abnormal signals
Modular disassembly and assembly structure, with individual disassembly of core components, saving time for maintenance and replacement
Low noise smooth operation, start stop buffer control, no impact damage to wafer edges
Compliant with semiconductor RoHS clean and environmentally friendly standards, suitable for compliance requirements of high-end production lines
ending
The Yaskawa XU-ACP130-B11 wafer pre aligner combines high precision, high efficiency, and clean durability, making it an essential alignment core component for 12 inch wafer processes.
Yaskawa XU-ACP130-B11晶圆预对准器 产品展示
视频展示
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
