KLA Tencor 710-806051-01单轴控制器

KLA-Tencor 710-806051-01单轴控制器

1.产 品 资 料 介 绍：

中文资料：

KLA Tencor 710-806051-01 是一款用于精密设备的 单轴运动控制器，常见于 KLA Tencor 的 晶圆检测与计量设备中。其主要功能是控制某一机械轴（如线性滑台或旋转平台）的精密运动，确保检测系统在扫描或对位过程中具备高重复精度和响应速度。

【产品应用领域】

1. 半导体晶圆表面检测系统

• 典型设备：如 Surfscan、SP1、SP2、2360 等

• 作用：驱动光学传感器或探头精确移动，实现高分辨率扫描晶圆表面，检测颗粒、划痕、异物等微缺陷。

2. 精密对位系统（Alignment Systems）

• 应用方式：控制设备内部一个单独运动轴，实现镜头、激光器或样品台的精确定位。

• 典型操作：纳米级别的对位调整，保障光学路径一致性。

3. 晶圆搬运与机械手臂系统

• 使用目的：在晶圆自动搬送或探头定位系统中，执行精密直线或旋转动作，配合工位间传输。

• 优势：高速响应、平稳移动、误差控制优异。

4. 光学检测平台的扫描运动

• 控制目标：扫描台或平台的单轴运动（如X轴、Y轴、Z轴或θ轴）。

• 配套设备：激光扫描仪、共聚焦显微系统等。

5. 晶圆厚度或平整度量测系统

• 控制内容：通过驱动Z轴位移，实现探针或光学头对不同点高度的扫描。

• 关键参数：亚微米精度、闭环反馈、高稳定性。

【特点总结】

英文资料：

KLA Tencor 710-806051-01 is a single axis motion controller used for precision equipment, commonly found in KLA Tencor's wafer inspection and metrology equipment. Its main function is to control the precise motion of a certain mechanical axis (such as a linear slide or rotating platform), ensuring that the detection system has high repeatability and response speed during scanning or alignment.

[Product Application Fields]

1. Semiconductor wafer surface inspection system

Typical devices: such as Surfscan, SP1, SP2, 2360, etc

Function: Drive optical sensors or probes to move accurately, achieve high-resolution scanning of wafer surfaces, and detect micro defects such as particles, scratches, and foreign objects.

2. Precision Alignment Systems

Application method: Control a separate motion axis inside the device to achieve precise positioning of the lens, laser, or sample stage.

Typical operation: Nano level alignment adjustment to ensure optical path consistency.

3. Wafer handling and robotic arm system

Purpose of use: To perform precise linear or rotational movements in wafer automatic transfer or probe positioning systems, in conjunction with inter station transfer.

Advantages: High speed response, smooth movement, excellent error control.

4. Scanning motion of optical detection platform

Control objective: Single axis motion of the scanning table or platform (such as X-axis, Y-axis, Z-axis, or θ axis).

Supporting equipment: laser scanner, confocal microscopy system, etc.

5. Wafer thickness or flatness measurement system

Control content: By driving Z-axis displacement, the probe or optical head can scan different heights of points.

Key parameters: sub micron accuracy, closed-loop feedback, high stability.

Summary of Characteristics

Project Description

Single axis control (suitable for controlling a single motion platform)

The interface method is usually based on the VME bus architecture

Application equipment such as wafer inspection equipment, defect detection equipment, image acquisition platform, etc

Control characteristics: high-precision position control, fast response, low drift

Can be integrated with linear encoders, servo motors, or stepper motors for complementary use

2.产      品      展      示      

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