KLA Tencor 710-658232-20内存控制器

KLA-Tencor  710-658232-20内存控制器

1.产 品 资 料 介 绍：

中文资料：

KLA Tencor 710-658232-20 内存控制器

产品概述：
该内存控制器是KLA Tencor晶圆检测系统（如2132系列）中用于数据管理与处理的重要核心模块，负责协调系统各处理器单元之间的数据流、缓存操作及内存访问控制，是确保整机高效运行的重要部件。

核心功能

1. 内存管理与优化
   控制系统中各数据缓存、DDR内存或嵌入式RAM模块之间的数据访问，提升内存带宽利用率，减少数据访问冲突。

2. 数据流协调
   实现图像采集卡、图像处理单元及存储控制器之间的数据交互调度，确保高速数据传输的准确性与时序匹配。

3. 指令调度与缓冲控制
   在实时图像分析与高速控制中，提供中断响应、读写优先级、FIFO管理等逻辑机制，保障数据处理的稳定性。

4. 系统总线接口支持
   与主板总线、PCI/PCIe子系统兼容，通过特定的总线协议与其他模块通信，支持高带宽数据通信链路。

技术特性

• 多层高密度PCB设计，具备较强的信号完整性与电磁兼容性能。

• 工业级元器件选用，长期工作于高负载、高洁净室要求的环境下稳定运行。

• 板载缓存系统，带有本地Cache及高速缓存控制逻辑，提高数据处理效率。

• 冗余保护机制，支持错误检测与纠正（ECC）或硬件看门狗功能，提升容错能力。

典型应用场景

• 晶圆缺陷检测设备：协调图像采集与图像处理单元间的大量高速数据流。

• 图像分析系统：为高速图像处理芯片提供缓存调度和内存控制服务。

• 半导体自动检测平台：集成于系统主控制框架中，作为数据通道的关键控制节点。

英文资料：

KLA Tencor 710-658232-20 Memory Controller

Product Overview:

This memory controller is an important core module used for data management and processing in KLA Tencor wafer inspection systems (such as the 2132 series). It is responsible for coordinating data flow, cache operations, and memory access control between various processor units in the system, and is an important component to ensure efficient operation of the entire machine.

Core functions

Memory Management and Optimization

Control the data access between various data caches, DDR memory, or embedded RAM modules in the system to improve memory bandwidth utilization and reduce data access conflicts.

Data flow coordination

Implement data exchange scheduling between image acquisition cards, image processing units, and storage controllers to ensure the accuracy and timing matching of high-speed data transmission.

Instruction scheduling and buffer control

In real-time image analysis and high-speed control, logical mechanisms such as interrupt response, read/write priority, and FIFO management are provided to ensure the stability of data processing.

System bus interface support

Compatible with motherboard bus and PCI/PCIe subsystem, communicates with other modules through specific bus protocols, and supports high bandwidth data communication links.

Technical Characteristics

Multi layer high-density PCB design with strong signal integrity and electromagnetic compatibility performance.

Industrial grade components are selected to operate stably in environments with high loads and clean room requirements for a long time.

Onboard cache system with local cache and high-speed cache control logic to improve data processing efficiency.

Redundancy protection mechanism, supporting error detection and correction (ECC) or hardware watchdog function to enhance fault tolerance.

Typical application scenarios

Wafer defect detection equipment: coordinates a large amount of high-speed data streams between image acquisition and image processing units.

Image analysis system: Provides cache scheduling and memory control services for high-speed image processing chips.

Semiconductor automatic detection platform: integrated into the main control framework of the system, serving as a key control node for the data channel.

2.产      品      展      示      

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