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TEL Tokyo Electron 3381-000065-13基板PCB

发布时间:2025-06-25人气:
  • TEL Tokyo Electron  3381-000065-13基板PCB
  • TEL Tokyo Electron  3381-000065-13基板PCB
  • TEL Tokyo Electron  3381-000065-13基板PCB

TEL Tokyo Electron 3381-000065-13基板PCB

1.产 品 资 料 介 绍:

中文资料:

TEL Tokyo Electron 3381-000065-13 基板 PCB
类型:功能控制基板 / Interface or Logic PCB
制造商:Tokyo Electron Ltd.(TEL)


一、产品功能概述

该基板为 TEL 半导体设备内部的一种专用电路板,通常用于:

  • 信号中继与分配:作为主控系统与下位执行单元之间的桥接电路板

  • 数据处理与逻辑控制:可能集成部分控制逻辑或信号处理功能

  • I/O 接口扩展:提供外部接口,连接传感器、驱动器、阀控器等

  • 电源管理:进行局部电源转换、滤波、保护等功能

⚙️ 该 PCB 通常属于设备中的“中间层”模块,承担设备某一特定子系统的功能接口任务。


二、典型应用领域

1. CVD / ALD 系统控制部分

  • 控制气体比例阀、真空泵启动信号、热板加热器等

  • 收集温度、气压等传感器信号,并进行前置调理

2. Etch 系统的电源/接口子模块

  • 实现 RF 功率模块与工艺主控系统之间的信号桥接

  • 管理射频匹配网络、功率开关模块

3. 晶圆搬运平台与 Loadlock 系统

  • 控制真空门、升降台、位移传感器的输入输出通道

  • 支持动作顺序控制、状态回读和动作反馈

4. 清洗或烘干系统

  • 控制泵、喷头、化学供给系统等子模块

  • 实现液位、温度、压力的信号检测与联动执行

英文资料:

TEL Tokyo Electron 3381-0000065-13 PCB substrate

Type: Function Control Board/Interface or Logic PCB

Manufacturer: Tokyo Electron Ltd. (TEL)


1、 Product Function Overview

This substrate is a specialized circuit board inside TEL semiconductor equipment, typically used for:


Signal Relay and Distribution: As a bridge circuit board between the main control system and the lower level execution unit


Data processing and logic control: may integrate partial control logic or signal processing functions


I/O interface expansion: Provides external interfaces to connect sensors, drivers, valve controllers, etc


Power management: perform local power conversion, filtering, protection and other functions


⚙️  This PCB usually belongs to the "middle layer" module in the device, responsible for the functional interface tasks of a specific subsystem of the device.


2、 Typical application areas

1. CVD/ALD system control part

Control gas proportional valve, vacuum pump start signal, hot plate heater, etc


Collect sensor signals such as temperature and air pressure, and perform pre conditioning


2. The power/interface submodule of the Etch system

Realize signal bridging between RF power module and process control system


Manage RF matching network and power switch module


3. Wafer handling platform and Loadlock system

Control the input and output channels of vacuum doors, lifting platforms, and displacement sensors


Support action sequence control, status feedback, and action feedback


4. Cleaning or drying system

Control sub modules such as pumps, nozzles, and chemical supply systems


Realize signal detection and linkage execution of liquid level, temperature, and pressure

2.产      品      展      示      

3381-000065-13_stage_base_pcb_97p7292_tokyo_electron_tel_2.jpg

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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