TEL Tokyo Electron 2L81-050032-V3处理器板
1.产 品 资 料 介 绍：
中文资料：
一、基本信息
产品型号：2L81-050032-V3
产品名称：处理器板 / 控制主板（Processor Board）
制造商：TEL — Tokyo Electron Limited（东京电子）
产品类型：嵌入式控制系统用 CPU 主板
版本号：V3（代表第三版或硬件修订版本）
二、主要功能
| 功能类别 | 功能说明 |
|---|---|
| 中央控制功能 | 承担系统主控任务，处理来自各模块的控制逻辑和数据交互。 |
| 任务调度与通信 | 管理多个设备子系统的控制信号收发，实现设备协调运行。 |
| 接口支持 | 提供与外部 I/O 板、通信模块、传感器等的连接能力。 |
| 实时数据处理 | 高速采集并处理传感器数据，响应外部事件和状态变化。 |
三、典型应用领域
该处理器板多用于 TEL 的高端晶圆制造设备中，例如：
光刻前/后处理设备（Coater / Developer）
控制显影单元、液体泵浦系统、烘烤单元、真空吸附装置等。
CVD / Etch 系统（化学气相沉积、蚀刻设备）
管理温度控制模块、真空系统、气体通道、电源控制等功能。
搬运系统（Loadport / Transfer Module）
控制晶圆传输机械臂、升降装置、载台对位机构等部件。
数据采集与通讯子系统
与上位主控系统（如 TEL 原厂中控系统）进行高速数据通信。
英文资料：
1、 Basic Information
Product model: 2L81-050032-V3
Product Name: Processor Board/Control Motherboard
Manufacturer: TEL - Tokyo Electron Limited
Product type: CPU motherboard for embedded control systems
Version number: V3 (representing the third edition or hardware revision version)
2、 Main functions
Function Category Function Description
The central control function undertakes the main control tasks of the system, processing control logic and data exchange from various modules.
Task scheduling and communication management involve the control signal transmission and reception of multiple device subsystems to achieve coordinated operation of devices.
The interface supports the ability to connect with external I/O boards, communication modules, sensors, etc.
Real time data processing involves high-speed collection and processing of sensor data, responding to external events and status changes.
3、 Typical application areas
This processor board is commonly used in TEL's high-end wafer manufacturing equipment, such as:
Photolithography pre-processing/post-processing equipment (Coater/Developer)
Control the developing unit, liquid pumping system, baking unit, vacuum adsorption device, etc.
CVD/Etch system (chemical vapor deposition, etching equipment)
Manage functions such as temperature control module, vacuum system, gas channel, power control, etc.
Loading port/Transfer Module
Control the wafer transfer robotic arm, lifting device, stage alignment mechanism, and other components.
Data Collection and Communication Subsystem
Perform high-speed data communication with the upper control system (such as TEL's original factory control system).
2.产 品 展 示
3.其他产品
4.其他英文产品
HONEYWELL TK-FTEB01 51309512-175 Bridge
RADISYS 61-0159-03 CPU circuit board
RADISYS 61-0158-04 CPU Control Card
| 33VM62-000-76 | 3090-SCCT084 | IC3600VMPA1 |
| 33VM62-000-75 | 3090-SCCT083 | IC3600VLEB1A |
| 33VM62-000-21 | 3090-SCCT063 | IC3600VLEA1 |
| 33VM62-000-17 | 3090-SCCT043 | IC3600VDAC1C |
| 33VM62-000-1 |  3090-SCCT032 | IC3600VDAC1 |
| 33VM52-020-9 | 3090-SCCT022 | IC3600VCDA1 |
| 33VM52-008-4 | 3090-RTM-317 | IC3600VBEA1 |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
