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TEL Tokyo Electron 2L81-000001-14接口PCB

发布时间:2025-07-09人气:
  • TEL Tokyo Electron 2L81-000001-14接口PCB
  • TEL Tokyo Electron 2L81-000001-14接口PCB
  • TEL Tokyo Electron 2L81-000001-14接口PCB

TEL Tokyo Electron  2L81-000001-14接口PCB

1.产 品 资 料 介 绍:

产品名称:

TEL Tokyo Electron 2L81-000001-14 接口 PCB
(Interface Printed Circuit Board)


产品功能简介:

该接口 PCB 是 TEL(Tokyo Electron)半导体制造设备中用于电信号连接、数据传输与控制模块通信的专用电路板。主要功能包括:

  • 在设备主控单元与外围子模块之间建立物理连接与数据通道

  • 管理多路数字/模拟 I/O 信号的接收与分发

  • 提供标准接口(如高速通信口、GPIO、串口、现场总线等)

  • 在一定程度上承担信号隔离、调理、转换等功能

  • 支持与执行机构、传感器、显示模块或其他 PCB 的互联互通


主要应用领域:

1. 设备控制信号分发中心

  • 用于 TEL 设备中主控系统与执行单元之间的信号接口枢纽

  • 连接如驱动板、电机控制板、加热器、真空阀、传感器等外围设备

2. 晶圆搬运与对位模块

  • 管理 EFEM、Load Port、Transfer Module 等子系统的控制/反馈信号

  • 实现晶圆传输过程中的精确同步与信号交换

3. 数据通信桥接模块

  • 实现高速信号中继与接口电平匹配

  • 支持与 TEL 内部总线结构或工厂网络系统通信

4. 模块化系统结构中的互连平台

  • 允许不同功能电路板通过接口 PCB 统一连接到设备控制总线或背板

  • 支持系统扩展或模块替换,提高设备维护灵活性

英文资料:

TEL Tokyo Electron 2L81-000001-14 Interface PCB

(Interface Printed Circuit Board)


Product Function Introduction:

This interface PCB is a dedicated circuit board used for electrical signal connection, data transmission, and control module communication in TEL (Tokyo Electron) semiconductor manufacturing equipment. The main functions include:


Establish physical connections and data channels between the main control unit of the device and the peripheral submodules


Manage the reception and distribution of multiple digital/analog I/O signals


Provide standard interfaces (such as high-speed communication port, GPIO, serial port, fieldbus, etc.)


To a certain extent, it undertakes functions such as signal isolation, conditioning, and conversion


Support interconnection and interoperability with actuators, sensors, display modules, or other PCBs


Main application areas:

1. Equipment Control Signal Distribution Center

Used as a signal interface hub between the main control system and the execution unit in TEL devices


Connect peripheral devices such as drive boards, motor control boards, heaters, vacuum valves, sensors, etc


2. Wafer handling and alignment module

Manage control/feedback signals for subsystems such as EFEM, Load Port, Transfer Module, etc


Realize precise synchronization and signal exchange during wafer transfer process


3. Data Communication Bridge Module

Realize high-speed signal relay and interface level matching


Support communication with TEL internal bus structure or factory network system


4. Interconnection Platform in Modular System Architecture

Allow different functional circuit boards to be uniformly connected to the device control bus or backplane through interface PCBs


Support system expansion or module replacement to improve equipment maintenance flexibility

2.产      品      展      示      

tokyo_electron_tel_2l08-000001-13_2l81-000001-14_tab111-1_io1_5.jpg

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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