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TEL Tokyo Electron 2180-021279-11印刷电路板

发布时间:2025-07-10人气:
  • TEL Tokyo Electron 2180-021279-11印刷电路板
  • TEL Tokyo Electron 2180-021279-11印刷电路板

TEL Tokyo Electron  2180-021279-11印刷电路板

1.产 品 资 料 介 绍:

产品名称:

Tokyo Electron (TEL) 2180-021279-11 印刷电路板 — 产品应用领域详解


一、产品功能定位

2180-021279-11 印刷电路板(PCB) 是 Tokyo Electron(TEL)半导体设备内部的重要电子组件,用于承载、连接并驱动各类电子元器件。此 PCB 板在系统中通常负责信号处理、功能逻辑执行或设备控制桥接,是控制系统与执行单元间实现高可靠性、高速数据传输的关键载体。


二、主要应用领域

1. 设备控制子系统中的核心功能板卡

  • 典型功能

    • 处理数字/模拟信号,完成逻辑控制、放大、滤波、转换等操作;

    • 担任控制器模块的辅助单元或独立子系统中的主控板;

    • 与温控、电机驱动、气体控制、真空系统等功能模块协作。

  • 应用设备

    • CVD、ALD、Etcher 等主机内部;

    • 晶圆搬运与传输系统;

    • 晶圆检测、监控单元;

    • 温度、气压、流量等工艺控制回路。


2. 信号桥接与子系统通信平台

  • 信号接口类型

    • 数字 I/O、模拟 I/O、RS-232/422、CAN、以太网或专用通信协议;

    • 可连接控制器模块、电源板、传感器、执行器、阀组等;

  • 主要职责

    • 实现系统内多个模块的数据通信与协同控制;

    • 对接人机界面(HMI)或主机软件系统,上传设备状态与运行参数。

英文资料:

Tokyo Electron (TEL) 2180-021279-11 Printed Circuit Board - Detailed Explanation of Product Application Fields


1、 Product functional positioning

2180-021279-11 Printed Circuit Board (PCB) is an important electronic component inside Tokyo Electron (TEL) semiconductor equipment, used to carry, connect, and drive various electronic components. This PCB board is usually responsible for signal processing, functional logic execution, or device control bridging in the system, and is a key carrier for achieving high reliability and high-speed data transmission between the control system and the execution unit.


2、 Main application areas

1. Core functional board in the equipment control subsystem

Typical functions:


Process digital/analog signals, complete logic control, amplification, filtering, conversion and other operations;


Serve as the auxiliary unit of the controller module or the main control board in an independent subsystem;


Collaborate with functional modules such as temperature control, motor drive, gas control, vacuum system, etc.


Application devices:


Internal components of CVD, ALD, Etcher and other hosts;


Wafer handling and transportation system;


Wafer inspection and monitoring unit;


Process control circuits for temperature, air pressure, flow rate, etc.


2. Signal bridging and subsystem communication platform

Signal interface type:


Digital I/O, analog I/O, RS-232/422, CAN, Ethernet, or dedicated communication protocols;


Can connect controller modules, power boards, sensors, actuators, valve groups, etc;


Main responsibilities:


Implement data communication and collaborative control among multiple modules within the system;


Docking with human-machine interface (HMI) or host software system, uploading device status and operating parameters.

2.产      品      展      示      

tokyo_electron_ttld03-11_dspp128b_2195-127423-11_2180-021279-11_pcb_i_o_board.jpg

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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