AMAT Applied Materials 0190-09597涂抹器组件

AMAT Applied Materials  0190-09597涂抹器组件

1.产 品 资 料 介 绍：

AMAT Applied Materials  0190-09597涂抹器组件 英文资料：

1、 Core positioning and system of the product

The 0190-09597 applicator component is a key process execution component in the semiconductor coating and development equipment (Track) of Applied Materials Company (AMAT), and belongs to the "photoresist precision coating system" product line. In the coating process of wafer lithography, the photoresist needs to evenly cover the surface of the wafer to form a thin film. This component serves as the "coating accuracy terminal" and is specially adapted to high-end coating and development equipment such as AMAT Lithium Pro and Endura Track. Through precise adhesive liquid transportation and coating structure, it achieves quantitative distribution, uniform extension, and thickness control of the photoresist, which is the core execution unit to ensure the transfer accuracy of lithography patterns and improve chip process yield.

2、 Analysis of core functions and technical characteristics

Considering the strict requirements for uniformity and accuracy in semiconductor photoresist coating (such as a thickness deviation of ≤± 1nm for 7nm process photoresist), the core characteristics of this applicator component can be accurately disassembled into the following points:

Precision glue measurement and transportation: Integrated volumetric ceramic metering pump, with a single glue transportation accuracy of ± 0.1 μ L, supporting an adjustable range of 0.5-50 μ L, suitable for different wafer sizes (8 inches/12 inches) and photoresist types (positive/negative, thick/thin) requirements. The conveying pipeline made of PTFE (polytetrafluoroethylene) material has an inner wall roughness of ≤ 0.1 μ m, which can prevent residue and contamination of the photoresist and meet the chemical inertness requirements of photoresist (such as avoiding reaction with solvents in photoresist).

Multi mode coating adaptation design: supports two mainstream coating modes: spin coating and slit coating. In the spin coating state, it is combined with a wafer suction cup with adjustable speed of 1000-10000rpm to achieve uniform extension of the adhesive liquid through centrifugal force; In the slit coating mode, the coating head is driven by a precision linear guide to move, with an adjustable coating speed of 0.1-5m/s and a coating width error of ≤± 0.5mm, suitable for high-precision requirements of thick adhesive coating in advanced processes such as MEMS structures.

Micron level thickness control capability: Equipped with a built-in laser interference thickness sensor, it can monitor the thickness of the coating film in real time, with a measurement accuracy of ± 0.5nm. Combined with PID closed-loop control algorithm, it can adjust the amount of coating solution and coating speed, and control the fluctuation of photoresist thickness on the wafer surface within ± 1%. The coating head adopts a diamond grinding nozzle, with a nozzle gap width accuracy of ± 1 μ m, ensuring the uniformity of the adhesive liquid and avoiding edge bead effect (adhesive liquid accumulates at the edge of the wafer).

 AMAT Applied Materials 0190-09597涂抹器组件 产品展示      

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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