KLA-Tencor 720-21901-003接口板
1.产 品 资 料 介 绍：
中文资料：
KLA Tencor 720-21901-003 接口板的产品应用领域：
1. 半导体晶圆检测系统
应用说明：用于晶圆表面缺陷检测系统中，实现从扫描光学系统接收到的模拟信号的放大与输出。
目标任务：提升图像采集信号质量，确保缺陷检测分析的高灵敏度与稳定性。
典型配套设备：KLA 2xxx、5xxx、6xxx 系列检测平台。
2. 图案叠加（Overlay）测量设备
应用说明：在多层图案对准精度测量中，通过接口板处理光学系统输出的干涉或成像信号。
目标任务：支持高分辨率图像采样，提供准确的坐标参考信号传输。
作用定位：位于成像系统与数据采集板（Data Acquisition Board）之间，作为桥梁。
3. 光学扫描系统
应用说明：在设备内部光学扫描头中采集反射或透射信号，通过接口板进行放大、滤波后送入控制模块。
目标任务：增强微弱光信号，适配后续电路的处理能力。
4. 自动化设备控制系统
应用说明：作为信号接口电路，与平台电机、传感器、光源等模块实现同步控制和反馈采集。
目标任务：协调扫描过程与位移控制之间的精确配合，提升扫描精度。
5. 设备通讯与系统集成模块
应用说明：通过接口板对接上位机或中央控制系统，实现测量信号的标准化输出。
目标任务：保证系统信号通信的稳定性、抗干扰能力，并可支持远程诊断功能。
总结：
| 应用领域 | 功能角色 |
|---|---|
| 晶圆缺陷检测设备 | 采集并放大光学图像信号 |
| 图案对准测量系统 | 精密图像同步传输接口模块 |
| 自动化控制系统 | 与光源、平台、探测器联动的中继组件 |
| 工厂设备集成系统 | 支持信号通信与设备联动的数据接口模块 |
英文资料：
Application areas of KLA Tencor 720-21901-003 interface board:
1. Semiconductor wafer inspection system
Application Description: Used in wafer surface defect detection systems to amplify and output analog signals received from scanning optical systems.
Target task: Improve the quality of image acquisition signals to ensure high sensitivity and stability in defect detection and analysis.
Typical supporting equipment: KLA 2xxx, 5xxx, 6xxx series detection platforms.
2. Pattern overlay measuring equipment
Application Description: In the measurement of multi-layer pattern alignment accuracy, the interference or imaging signals output by the optical system are processed through an interface board.
Target task: Support high-resolution image sampling and provide accurate coordinate reference signal transmission.
Function positioning: Located between the imaging system and the Data Acquisition Board, serving as a bridge.
3. Optical scanning system
Application description: Collect reflected or transmitted signals in the optical scanning head inside the device, amplify and filter them through the interface board, and send them to the control module.
Target task: Enhance weak light signals and adapt to the processing capabilities of subsequent circuits.
4. Automation equipment control system
Application Description: As a signal interface circuit, it can achieve synchronous control and feedback acquisition with platform motors, sensors, light sources, and other modules.
Target task: Coordinate the precise coordination between the scanning process and displacement control to improve scanning accuracy.
5. Device Communication and System Integration Module
Application Description: Connect to the upper computer or central control system through an interface board to achieve standardized output of measurement signals.
Target task: Ensure the stability and anti-interference ability of system signal communication, and support remote diagnostic function.
Summary:
Application domain functional roles
Wafer defect detection equipment collects and amplifies optical image signals
Precision Image Synchronization Transmission Interface Module for Pattern Alignment Measurement System
Relay components that link automation control systems with light sources, platforms, and detectors
The factory equipment integration system supports data interface modules for signal communication and equipment linkage
2.产 品 展 示
3.其他产品
4.其他英文产品
Schneider 140CPS11100 Analog Input Modul
ABB 3DDE300417 Input/Output Board
GE IS210BPPBH2BMD Controller Module
| SC726A-001 | SC726A-001-PM72009 | SCE904-002-01 A |
| SC725B001-01 | SC453-016-02 | SC904AN-046-01 |
| SC725B00101 | SC453-004-15 | SCE906-001-01 |
| SC725A-001-PM72016 | SC453-804-05 | SCE904-001-01 |
| SC725A-001-PM72012 | SC452-815-05 | SC9020010104G108 |
| SC725A-001-PM72008 | SC453-040-08 | SC900-001-01 |
| SC725A-001-01 | SC722A-001-PM72008 | SCE905-001-00 |
| SC725A-001 | SC452-051-06 | SC902-001-01 |
