TEL Tokyo Electron 3884-200219-31 CPU模块
1.产 品 资 料 介 绍:
TEL Tokyo Electron 3884-200219-31 CPU模块 是用于半导体制造设备中的核心控制单元,主要承担系统运算、信号处理、设备控制等功能,属于设备的大脑部分。该模块通常集成在 TEL 的主控框架中,用于协调和管理各种子系统(如气体控制、温度控制、运动控制等)。
一、产品基本信息
型号: 3884-200219-31
产品名称: CPU 模块 / 中央处理模块
制造商: Tokyo Electron (TEL)
适配平台: TEL 专用半导体设备,如沉积设备(CVD)、蚀刻机、清洗设备等
二、功能与作用
中央处理单元
管理所有设备子模块,如气体流量控制、电源系统、I/O接口、用户界面等。
运行设备控制软件,实现顺序逻辑、实时任务调度。
I/O 信号管理
通过总线(如VME、PCI、PXI等)与外围设备通信。
接收传感器信号,控制执行器动作。
与人机界面(HMI)通讯
提供状态显示、报警、参数设置等接口支持。
运行操作系统
可能运行嵌入式实时操作系统(如 VxWorks、QNX、或TEL定制RTOS),支持稳定的控制性能。
三、典型应用领域
薄膜沉积设备(CVD/PVD)
控制反应温度、气体流量、真空环境,确保沉积均匀性。
等离子蚀刻设备(Etchers)
实时监控腔体状态并动态调整蚀刻参数。
清洗设备(Wet Bench)
管理液体化学品、泵阀切换、槽体温度控制等。
量测与检测模块
协调图像处理、信号采集与测量数据传输等功能。
英文资料:
The TEL Tokyo Electron 3884-200219-31 CPU module is a core control unit used in semiconductor manufacturing equipment, mainly responsible for system operations, signal processing, equipment control, and other functions. It belongs to the brain part of the equipment. This module is typically integrated into the main control framework of TEL, used to coordinate and manage various subsystems such as gas control, temperature control, motion control, etc.
1、 Basic Product Information
Model: 3884-200219-31
Product Name: CPU Module/Central Processing Module
Manufacturer: Tokyo Electron (TEL)
Adaptation platform: TEL dedicated semiconductor equipment, such as deposition equipment (CVD), etching machines, cleaning equipment, etc
2、 Function and Function
Central Processing Unit
Manage all device sub modules, such as gas flow control, power system, I/O interfaces, user interfaces, etc.
Run device control software to achieve sequential logic and real-time task scheduling.
I/O signal management
Communicate with peripheral devices through buses such as VME, PCI, PXI, etc.
Receive sensor signals and control actuator actions.
Communication with Human Machine Interface (HMI)
Provide interface support for status display, alarm, parameter settings, etc.
Running the operating system
May run embedded real-time operating systems (such as VxWorks, QNX, or TEL custom RTOS), supporting stable control performance.
3、 Typical application areas
Thin film deposition equipment (CVD/PVD)
Control the reaction temperature, gas flow rate, and vacuum environment to ensure deposition uniformity.
Plasma etching equipment (Etchers)
Real time monitoring of cavity status and dynamic adjustment of etching parameters.
Cleaning equipment (Wet Bench)
Manage liquid chemicals, pump valve switching, tank temperature control, etc.
Measurement and detection module
Coordinate functions such as image processing, signal acquisition, and measurement data transmission.
2.产 品 展 示
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
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