TEL Tokyo Electron E281-000029-12 PCB背板
1.产 品 资 料 介 绍：
TEL Tokyo Electron E281-000029-12 PCB 背板 是一款用于半导体设备中的印刷电路背板（Backplane PCB），在系统中承担模块化组件之间的电气连接与通信功能。该背板是多个功能模块（如 CPU 模块、I/O 模块、电源模块等）的基础支撑平台，确保各子模块能够在同一总线架构下协同工作。
一、产品基本信息
产品型号： E281-000029-12
产品名称： PCB 背板 / Backplane PCB
制造商： Tokyo Electron Ltd.（TEL）
应用类型： 系统总线连接平台，用于多个控制模块的集成和互连
二、功能作用
模块插槽连接
提供多个模块（如 CPU、DI/DO、驱动器、电源板等）物理安装与电气连接的插槽或接口。
一般通过金手指或DIN插座与模块卡件对接。
系统内部通信
实现多模块间的数据交换（如 TTL、RS485、CAN、VME、PXI等总线协议），是整个控制系统的数据骨干。
电源与信号分配
为各模块提供电源分配（如 +5V、+12V、+24V 等）；
分发控制信号和系统时钟脉冲等同步信号。
结构支持功能
作为模块框架的一部分，提供模块卡件的固定与导向功能，增强设备结构可靠性。
三、应用领域
E281-000029-12 背板 主要用于以下 TEL 设备与系统平台中：
半导体工艺设备控制系统
包括 CVD、Etcher、Track、Coater/Developer、Wet Bench 等核心设备。
控制模块集成系统
安装在电控机箱内部，用于整合各功能板卡，实现一体化信号控制与管理。
高可靠工业自动化平台
可配合 TEL 定制主控平台或第三方工业控制计算机共同使用。
英文资料：
TEL Tokyo Electron E281-000029-12 PCB Backplane is a printed circuit backplane (Backplane PCB) used in semiconductor devices, responsible for electrical connections and communication between modular components in the system. This backplane is the basic support platform for multiple functional modules (such as CPU modules, I/O modules, power modules, etc.), ensuring that each submodule can work together under the same bus architecture.
1、 Basic Product Information
Product model: E281-000029-12
Product Name: PCB Backplane PCB
Manufacturer: Tokyo Electron Ltd. (TEL)
Application type: System bus connection platform, used for integration and interconnection of multiple control modules
2、 Functional function
Module slot connection
Provide slots or interfaces for physical installation and electrical connection of multiple modules (such as CPU, DI/DO, drivers, power boards, etc.).
Generally, it is connected to the module card through a gold finger or DIN socket.
Internal communication within the system
Implementing data exchange between multiple modules (such as TTL, RS485, CAN, VME, PXI and other bus protocols) is the data backbone of the entire control system.
Power and signal distribution
Provide power distribution for each module (such as+5V,+12V,+24V, etc.);
Distribute control signals and synchronization signals such as system clock pulses.
Structural support function
As part of the module framework, it provides the fixing and guiding functions of module cards to enhance the reliability of equipment structure.
3、 Application Fields
The E281-000029-12 backplane is mainly used in the following TEL devices and system platforms:
Semiconductor process equipment control system
Including core equipment such as CVD, Etcher, Track, Coater/Developer, Wet Bench, etc.
Control module integration system
Installed inside the electronic control chassis, it is used to integrate various functional boards and achieve integrated signal control and management.
High reliability industrial automation platform
Can be used in conjunction with TEL customized main control platform or third-party industrial control computers.
2.产 品 展 示
3.其他产品
4.其他英文产品
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Emerson P144.R4 Intelligent I/O Board
ABB XVC768117 Field Input/Output Module
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
