TEL Tokyo Electron E249-000001-11触感扫描仪

TEL Tokyo Electron   E249-000001-11触感扫描仪

1.产 品 资 料 介 绍：

产品名称：

Tokyo Electron (TEL) E249-000001-11 触感扫描仪 — 产品应用领域详解

一、产品功能定位

E249-000001-11 触感扫描仪 是一款集成于 TEL 半导体设备系统中的高精度表面扫描与接触感应装置，通常用于检测晶圆或材料表面的物理状态，如形貌偏差、位置校准、翘曲、接触压力等。该模块结合机械臂或扫描平台，用于工艺前后或装载过程中对目标表面进行扫描检测或触感反馈采集。

二、主要应用领域

1. 晶圆装载与位置对准

• 应用设备：

  • 晶圆搬运单元（Load Port）

  • 自动化对准系统（Aligner）

  • Transfer Arm 系统中的检测子模块

• 功能说明：

  • 在晶圆加载过程中，触感扫描仪检测晶圆是否正确放置在对准台或卡盘上；

  • 判断是否存在偏移、翻转、错位、缺片等问题；

  • 与视觉系统协作，提高搬运精度与设备运行安全性。

2. 表面翘曲与平整度扫描检测

• 检测内容：

  • 晶圆或玻璃基板的局部翘曲程度；

  • 表面弯曲或边缘起伏；

  • 可联动压力感应反馈进行物理测量（如微接触高度差）；

• 应用场景：

  • 在 ALD、PVD、CMP、Etch 等工艺前确认表面平整度是否在可控范围内，避免后续工艺失败。

英文资料：

Tokyo Electron (TEL) E249-000001-11 Touch Scanner - Detailed Explanation of Product Application Fields

1、 Product functional positioning

E249-000001-11 tactile scanner is a high-precision surface scanning and contact sensing device integrated into TEL semiconductor equipment systems. It is commonly used to detect the physical state of wafer or material surfaces, such as morphology deviation, position calibration, warping, contact pressure, etc. This module, combined with a robotic arm or scanning platform, is used for scanning and detecting the target surface or collecting tactile feedback before and after the process or during the loading process.

2、 Main application areas

1. Wafer loading and positioning alignment

Application devices:

Wafer handling unit (load port)

Automated Alignment System (Aligner)

Detection submodule in Transfer Arm system

Function Description:

During the wafer loading process, the tactile scanner checks whether the wafer is correctly placed on the alignment table or chuck;

Determine whether there are issues such as offset, flip, misalignment, or missing pieces;

Collaborate with the visual system to improve handling accuracy and equipment operational safety.

2. Surface warping and flatness scanning detection

Testing content:

The degree of local warping of wafers or glass substrates;

Surface curvature or edge undulation;

Can be linked with pressure sensing feedback for physical measurement (such as micro contact height difference);

Application scenarios:

Confirm whether the surface flatness is within a controllable range before ALD, PVD, CMP, Etch and other processes to avoid subsequent process failures.

2.产      品      展      示      

3.其他产品

Advantech PCL-81601采集板

A-B 1794-IRT8XT 继电器输出模块

GE  IS420PUAAH1A  以太网交换机

4.其他英文产品

Kollmorgen MMC-SD-0.5-230-D servo drive

ABB 70PR05b-ES Control Panel

YT204001-KA/5 voltage signal regulator

The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218