TEL Tokyo Electron 3D80-000710-V3冷却机组件
1.产 品 资 料 介 绍：
产品名称：
Tokyo Electron 3D80-000710-V3 冷却机组件 是用于半导体制造设备中的关键热管理单元，其主要功能是对设备内部产生的热量进行有效控制和散热，保障系统在高精度、高负载运行下的稳定性和性能。以下是其产品应用领域的详细分析：
一、主要应用领域
半导体蚀刻设备（Etching Systems）
冷却机组件用于控制反应腔温度，防止等离子体处理过程中产生过热现象。
确保工艺气体反应的温控精度，提高蚀刻图形一致性。
化学气相沉积系统（CVD, PECVD, SACVD 等）
在薄膜沉积过程中冷却反应腔体、基板传送系统、真空泵等关键子系统。
控制热负荷以提升膜厚均匀性与成膜质量。
光刻设备（Lithography Equipment）
用于冷却曝光系统的光源模块或曝光台底板，保障曝光精度。
在高重复频率操作中维持系统热稳定性，降低热漂移误差。
晶圆传送与对准模块（Wafer Transfer & Alignment Systems）
对马达驱动部件或传送机械臂提供冷却，延长设备使用寿命。
保持恒温状态，提高晶圆对准精度与机械响应速度。
真空泵及冷却循环系统
与工艺泵系统耦合，作为制程运行中辅助热管理单元。
控制真空腔体内的温度，提升抽气系统效率。
英文资料：
The Tokyo Electron 3D80-000710-V3 cooling unit is a critical thermal management unit used in semiconductor manufacturing equipment. Its main function is to effectively control and dissipate the heat generated inside the equipment, ensuring the stability and performance of the system under high-precision and high load operation. The following is a detailed analysis of its product application areas:
1、 Main application areas
Semiconductor Etching Systems
The cooling machine component is used to control the temperature of the reaction chamber and prevent overheating during plasma processing.
Ensure the temperature control accuracy of process gas reaction and improve the consistency of etching patterns.
Chemical vapor deposition systems (CVD, PECVD, SACVD, etc.)
During the thin film deposition process, key subsystems such as the cooling reaction chamber, substrate transfer system, and vacuum pump are cooled.
Control heat load to improve film thickness uniformity and film quality.
Lithography Equipment
Used to cool the light source module or exposure stage substrate of the exposure system, ensuring exposure accuracy.
Maintain system thermal stability and reduce thermal drift errors during high repetition rate operations.
Wafer Transfer&Alignment Systems
Provide cooling for motor driven components or conveying robotic arms to extend equipment lifespan.
Maintain a constant temperature to improve wafer alignment accuracy and mechanical response speed.
Vacuum pump and cooling circulation system
Coupled with the process pump system, serving as an auxiliary thermal management unit during process operation.
Control the temperature inside the vacuum chamber to improve the efficiency of the pumping system.
2.产 品 展 示
3.其他产品
ABSOLUTE PROCESS API4380GD隔离变送器
4.其他英文产品
ASEA DSPC150 Robot Control Board
| VC3640-450-1-56C | SC453-017-05 | ics triplex t7310 |
| VC3640-449-1-48C | SC452-017-05 | SC953TN-501-01 |
| VC3640-419-1-56C | SC453-037-15 | SC903-050-01 |
| VC3640-405-1-56D | SC453-011-05 | SC933AN-001-01 |
| VC3640-405-1-48C | SC453-029-06 | SC904-001-01 |
| VC3640-278-1-48C | SC452-012-05 | SC904AN-001-01 |
| URRHH | CACR-IR101010F-D | SC933AN-050-01 |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
