1.产 品 资 料 介 绍：
TEL 3B87-003543-11 is an integrated heater assembly specifically designed for semiconductor chambers at Tokyo Electronics, used for constant temperature control in wafer process chambers.
1. Aluminum nitride based heating core with fast thermal conductivity and excellent thermal uniformity
2. Integrated built-in K-type temperature measuring thermocouple, real-time collection of chamber temperature data
3. Integrated sealed packaging, suitable for dust-free and non-volatile working conditions in vacuum chambers
4. High precision power matching, fast PID temperature control response, and minimal temperature control error
5. Plasma corrosion-resistant coating, suitable for etching and thin film deposition process environments
6. Customized snap on installation structure, the cavity slot can be disassembled in situ without the need for modification
7. Anti overheating fuse protection, automatic power-off to avoid damage to the cavity when overheating occurs
8. Original factory standard wiring terminals, and direct insertion docking with device driver modules
9. Low thermal expansion material, not easily deformed, cracked or leaked during high and low temperature cycling
10. Chamber partition heating design ensures consistent heating of the entire wafer
11. The insulation withstand voltage meets the standard, and there is no leakage or ignition hazard in the vacuum environment
12. Resist high-frequency electromagnetic interference and match the overall working conditions of the RF cavity
13. Factory preset power parameters, no need to re debug the program after replacement
14. Fragile spare parts for semiconductor equipment, direct replacement for faults and quick resumption of production
15. Compatible with TEL series glue coating and etching equipment constant temperature chamber workstation
TEL 3B87-003543-11 is a core heating spare for semiconductor process chambers.
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
