1.产 品 资 料 介 绍:
KAWASAKI 3NS004S-C008 机器人激光模块
开头
KAWASAKI 3NS004S-C008 为川崎半导体晶圆机器人专用 1 类激光对位模块,集成激光检测与晶片预对准功能,用于硅片边缘定位校正,适配无尘晶圆传输设备。
Class1 安全激光光源,无尘车间使用无辐射安全隐患
高精度激光传感检测,晶片对位角度误差控制极小
适配 300mm 标准晶圆,兼容石英片、硅片多种基材
高速对位运算,单次晶片校准完成速度快
一体化光路与信号采集集成,模块结构紧凑
内置光电隔离电路,隔绝机器人电机电磁干扰
多重静电、过流防护,避免晶圆静电损伤风险
洁净级不锈钢外壳,防尘耐腐蚀适配真空腔体
专用通讯接口,直连川崎晶圆机器人主控系统
实时输出对位偏移数据,联动机械手补偿坐标
低功耗光路设计,长时间连续工作温升低
自带状态指示灯,快速识别激光、传感故障
可自定义对位参数,适配不同工艺晶片需求
标准化卡扣安装,拆装更换无需拆解腔体
独立通道自检功能,上电自动校验激光输出强度
结尾
KAWASAKI 3NS004S-C008 机器人激光模块对位精准、洁净安全,是半导体晶圆搬运机器人晶片预对准核心组件。
KAWASAKI 3NS004S-C008机器人激光模块 产品英文
KAWASAKI 3NS004S-C008 Robot Laser Module
beginning
KAWASAKI 3NS004S-C008 is a Class 1 laser alignment module specifically designed for Kawasaki Semiconductor wafer robots. It integrates laser detection and chip pre alignment functions and is used for edge positioning correction of silicon wafers, adapting to dust-free wafer transfer equipment.
Class1 safe laser light source, used in dust-free workshops without radiation safety hazards
High precision laser sensing detection with minimal control of chip alignment angle error
Compatible with 300mm standard wafers, compatible with various substrates such as quartz and silicon wafers
High speed alignment calculation, fast completion speed of single chip calibration
Integrated optical path and signal acquisition, compact module structure
Built in photoelectric isolation circuit to isolate electromagnetic interference from robot motors
Multiple static electricity and overcurrent protection to avoid the risk of wafer static electricity damage
Clean grade stainless steel shell, dustproof and corrosion-resistant, suitable for vacuum chamber
Dedicated communication interface, directly connected to Kawasaki wafer robot main control system
Real time output of alignment offset data, coordinated with mechanical arm compensation coordinates
Low power optical path design, long-term continuous operation with low temperature rise
Equipped with a status indicator light, quickly identify laser and sensor faults
Customizable alignment parameters to adapt to different process chip requirements
Standardized buckle installation, disassembly and replacement without disassembling the cavity
Independent channel self-test function, automatically verifies laser output intensity when powered on
ending
KAWASAKI 3NS004S-C008 robot laser module has precise alignment, cleanliness and safety, and is the core component of semiconductor wafer handling robot chip pre alignment.
KAWASAKI 3NS004S-C008机器人激光模块 产品展示

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218




