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Hirata AR-W170VCL-4-T-40四轴双臂机器人

发布时间:2026-09-04人气:
  • Hirata AR-W170VCL-4-T-40四轴双臂机器人
  • Hirata AR-W170VCL-4-T-40四轴双臂机器人
  • Hirata AR-W170VCL-4-T-40四轴双臂机器人

Hirata AR-W170VCL-4-T-40四轴双臂机器人 

1.产 品 资 料 介 绍:

Hirata AR‑W170VCL‑4‑T‑40 四轴双臂机器人,是平田机工的真空晶圆搬运机械手,用在半导体设备真空腔体内,双臂交替取送晶圆,直接决定机台的吞吐能力。
产品特点
1、四轴联动双臂结构,一臂取片一臂放片交替作业,有效缩短晶圆交换时间,提升整机产能
2、直驱电机搭配钢带传动,运行抖动小,高速移动也不容易刮伤晶圆,颗粒管控做得好
3、内置碰撞检测,碰到异物会立刻停机,最大程度保护硅片与臂体,减少现场重大损失
4、真空专用密封结构,低释气材质,适配高真空腔体,不会污染工艺环境
5、绝对值编码器设计,断电不用担心原点丢失,现场调试、备件更换都更省事
产品参数
1、适配 300mm 晶圆搬运,真空环境下工作
2、四轴伺服驱动,微米级重复定位精度
3、支持设备总线通讯,和整机主控联动调度
4、腔体内部真空工况,耐受半导体设备内部环境
5、真空法兰一体式安装,直接装配到工艺设备腔体
应用领域
1、刻蚀、薄膜沉积设备真空腔体晶圆传输
2、集群式半导体设备负载锁内部搬运单元
3、真空工艺腔之间晶圆流转作业
4、300mm 晶圆制程设备内部机械手单元
5、产线老旧机台故障机器人备件替换
Hirata AR‑W170VCL‑4‑T‑40 四轴双臂机器人属于真空端核心搬运部件,一旦出现抖动、定位偏移,很容易出现掉片、碎片,直接造成晶圆报废。

Hirata AR-W170VCL-4-T-40四轴双臂机器人 产品英文介绍

The Hirata AR-W170VCL-4-T-40 four axis dual arm robot is a vacuum wafer handling manipulator used by Hirata Machinery. It is used in the vacuum chamber of semiconductor equipment, and its arms alternate to pick up and deliver wafers, directly determining the throughput capacity of the machine.

Product Features

1. Four axis linkage dual arm structure, with one arm picking and the other arm releasing chips alternately, effectively reducing wafer exchange time and improving overall production capacity

2. Direct drive motor paired with steel belt drive, with minimal vibration during operation and low risk of scratching the wafer during high-speed movement. Good particle control is also achieved

3. Built in collision detection, it will immediately stop when encountering foreign objects, providing maximum protection for the silicon wafer and arm, reducing significant losses on site

4. Vacuum specific sealing structure, low gas release material, suitable for high vacuum chambers, will not pollute the process environment

5. Absolute value encoder design, no need to worry about losing the origin when power is off, on-site debugging and spare parts replacement are more convenient

Product Specifications

1. Suitable for 300mm wafer handling and working in a vacuum environment

2. Four axis servo drive, micrometer level repetitive positioning accuracy

3. Support device bus communication and linkage scheduling with the main control of the entire machine

4. Vacuum working condition inside the cavity, able to withstand the internal environment of semiconductor equipment

5. Vacuum flange integrated installation, directly assembled into the process equipment chamber

Application Areas

1. Etching and thin film deposition equipment, vacuum chamber wafer transfer

2. Internal handling unit of load lock for clustered semiconductor equipment

3. Wafer transfer operation between vacuum process chambers

4. Internal robotic arm unit of 300mm wafer processing equipment

5. Replacement of spare parts for faulty robots on old production line machines

The Hirata AR-W170VCL-4-T-40 four axis dual arm robot belongs to the core handling component of the vacuum end. Once there is shaking or positioning deviation, it is easy to cause wafer dropping and fragmentation, directly resulting in wafer scrap.

Hirata AR-W170VCL-4-T-40四轴双臂机器人 产品展示

AR-W170VCL-4-T-40.webp.jpg

视频展示


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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218 

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