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AMAT Applied Materials 0100-02715背板

发布时间:2025-09-24人气:
  • AMAT Applied Materials 0100-02715背板
  • AMAT Applied Materials 0100-02715背板
  • AMAT Applied Materials 0100-02715背板

AMAT Applied Materials 0100-02715背板

1.产 品 资 料 介 绍:

AMAT Applied Materials 0100-02715 是一款高密多层无源背板,作为半导体制造设备内部子系统间的信号与电源主干连接,提供高速、低损耗、高可靠性的互连平台。

核心规格

项目规格
板层结构8–16 层高速 PCB(可选更高层数)
材料体系低损耗板材(如 Isola 370HR、Rogers 4350B),高 Tg(170℃+)
尺寸标准 19 英寸机架适配,或按设备定制
连接器类型高密度欧式针座、压接式连接器,支持热插拔
信号特性支持高速差分信号(如 LVDS、PCIe),全线阻抗控制
电源分配多轨隔离电源平面(5V、12V、24V),铜平面承载大电流
工作温度-10℃~60℃
隔离与防护信号与电源间≥5kVrms 隔离,表面涂覆防潮防腐蚀涂层
背板类型无源背板,不含主动信号处理电路

功能特点

  • 模块化插槽设计:支持多块子板并行接入,实现系统灵活扩展
  • 低噪声设计:多层平面 + 屏蔽层结构,抑制串扰与 EMI 干扰
  • 热插拔能力:带电更换子板,降低停机时间
  • 高机械强度:厚铜层 + 高强度基材,承受多次插拔不变形
  • 状态监测:配备电源与信号指示灯,便于快速故障定位

典型应用

  • 半导体刻蚀机、PVD/CVD 沉积设备的控制与数据传输
  • 离子注入机的信号分配与同步控制
  • 真空系统、工艺腔室与机器人控制单元的互联

安装与维护建议

  1. 安装
    • 安装于设备屏蔽良好的机架内,远离强电磁干扰源
    • 确保背板与子板连接器完全对齐并锁定
  2. 接线
    • 严格按引脚定义区分信号与电源,避免错接
    • 建议使用屏蔽线并单点接地,减少干扰
  3. 维护
    • 每 6–12 个月检查连接器紧固度,防止氧化松动
    • 定期清洁灰尘,确保散热良好
    • 更换子板时遵循防静电规范,防止静电损坏背板

AMAT Applied Materials 0100-02715背板 英文资料:

AMAT Applied Materials 0100-02715 is a high-density multi-layer passive backplane that serves as the signal and power backbone connection between subsystems within semiconductor manufacturing equipment, providing a high-speed, low loss, and high reliability interconnect platform.

Core specifications

Project specifications

Board structure 8-16 layer high-speed PCB (optional higher layers)

Low loss board material system (such as Isola 370HR, Rogers 4350B), high Tg (170 ℃+)

Size standard 19 inch rack adaptation, or customized according to equipment

Connector type: high-density European style needle socket, crimping connector, supporting hot plugging

Signal characteristics support high-speed differential signals (such as LVDS, PCIe) and full line impedance control

Power distribution multi rail isolated power plane (5V, 12V, 24V), copper plane carries high current

Working temperature -10 ℃~60 ℃

Isolation and protection: The signal and power supply should be isolated by ≥ 5kVrms, and the surface should be coated with a moisture-proof and corrosion-resistant coating

Backboard type: Passive backplane, without active signal processing circuit

Features

Modular slot design: supports parallel access of multiple daughter boards, enabling flexible system expansion

Low noise design: multi-layer planar+shielding layer structure, suppressing crosstalk and EMI interference

Hot swappable capability: replace daughter board with power on, reduce downtime

High mechanical strength: thick copper layer+high-strength substrate, capable of withstanding multiple insertions and removals without deformation

Status monitoring: equipped with power and signal indicator lights for quick fault location

Typical Applications

Control and Data Transmission of Semiconductor Etching Machines and PVD/CVD Deposition Equipment

Signal distribution and synchronization control of ion implantation machine

Interconnection of vacuum system, process chamber and robot control unit

Installation and maintenance recommendations

install

Installed in a well shielded rack away from strong electromagnetic interference sources

Ensure that the backplane and daughter board connectors are fully aligned and locked

wiring

Strictly distinguish signals and power supplies according to pin definitions to avoid misconnection

Suggest using shielded wires and single point grounding to reduce interference

maintenance

Check the tightness of the connector every 6-12 months to prevent oxidation and loosening

Regularly clean dust to ensure good heat dissipation

When replacing the daughter board, follow the anti-static regulations to prevent static electricity from damaging the back panel

AMAT Applied Materials  0100-02715背板 产品展示      

applied_materials_0100-02715_rev_02_backplane_300mm_linear_platform.jpg

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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