AMAT Applied Materials AS01391-21-1印刷电路板

AMAT Applied Materials AS01391-21-1印刷电路板

1.产 品 资 料 介 绍：

核心规格

功能特点

• 高速信号传输：采用差分对与阻抗控制（50/90 Ω），确保时钟、数据信号低失真。
• 高可靠性设计：多层接地与电源平面，降低噪声干扰。
• 高精度制造：孔位精度 ±0.05 mm，满足 BGA、QFP 等高密度器件贴装。
• 易于维护：表面 ENIG 处理抗氧化、耐腐蚀，延长使用寿命。

应用领域

• 半导体薄膜沉积、刻蚀、离子注入设备的控制与接口模块。
• 真空系统、气体流量控制、温度监测等子系统电路。

更换与注意事项

1. 确认版本：核对物料编码 AS01391‑21‑1 与版本号，确保电气兼容。
2. 防静电：佩戴防静电手环，在防静电台垫上操作。
3. 安装定位：按机箱定位孔与接插件方向安装，避免错位。
4. 焊接要求：回流焊温度峰值 245～255℃，波峰焊温度 250～260℃，防止板材分层。
5. 测试：安装后进行电源、信号完整性与功能测试，确保无短路或信号异常。

AMAT Applied Materials AS01391-21-1印刷电路板 英文资料：

AMAT AS01391-21-1 is a customized printed circuit board specifically designed for semiconductor equipment by Applied Materials Company. It is used for control and signal transmission on platforms such as Centura, Endura, P5000, ensuring stable operation of equipment and accurate data transmission.

Core specifications

Project specifications/parameter notes

Type: Multi layer rigid PCB (6-8 layers), high-speed signal and complex wiring

Stable dielectric properties of substrates with high TG FR-4 or Rogers high-frequency materials

Size 200 × 150 mm (± 0.1 mm) standard chassis adapter

Minimum line width/line spacing 0.10 mm/0.10 mm high-density wiring

The minimum aperture of 0.20 mm (PTH) meets the requirements of BGA and other components

Surface treatment ENIG (chemical nickel/immersion gold) for high reliability and weldability

Solder mask color green (optional blue/black) standard process

Copper foil thickness: 1 oz for inner layer and 2 oz for outer layer, balancing signal and power

Working temperature -20~+60 ℃ Industrial environment

Certification of CE, UL, RoHS international safety standards

Features

High speed signal transmission: differential pair and impedance control (50/90 Ω) are used to ensure low distortion of clock and data signals.

High reliability design: multi-layer grounding and power plane to reduce noise interference.

High precision manufacturing: hole position accuracy ± 0.05 mm, meeting the requirements for high-density device mounting such as BGA and QFP.

Easy to maintain: Surface treated with ENIG for oxidation resistance, corrosion resistance, and extended service life.

Application field

Control and interface module for semiconductor thin film deposition, etching, and ion implantation equipment.

Subsystem circuits for vacuum system, gas flow control, temperature monitoring, etc.

Replacement and precautions

Confirm version: Verify the material code AS01391-21-1 with the version number to ensure electrical compatibility.

Anti static: Wear an anti-static wristband and and operate on the anti-static mat.

Installation positioning: Install according to the chassis positioning hole and connector direction to avoid misalignment.

Welding requirements: The peak temperature for reflow soldering is 245-255 ℃, and the peak temperature for wave soldering is 250-260 ℃ to prevent delamination of the sheet metal.

Testing: Conduct power, signal integrity, and functional testing after installation to ensure no short circuits or signal abnormalities.

AMAT Applied Materials AS01391-21-1印刷电路板 产品展示      

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218