AMAT Applied Materials 0190-11570射频匹配器

AMAT Applied Materials  0190-11570射频匹配器

1.产 品 资 料 介 绍：

AMAT Applied Materials  0190-11570射频匹配器 英文资料：

1、 Product core positioning

AMAT 0190-11570 is an automatic RF matching device specially designed by Applied Materials for semiconductor plasma processes, and belongs to the core regulating component of RF power transmission systems. Its core function is to dynamically match the impedance difference between the RF power supply and the plasma load. By adjusting the internal adjustable capacitor in real time, the reflected power is minimized to ensure efficient and stable transmission of RF energy to the etching or deposition reaction chamber. It is a key equipment to ensure process uniformity and equipment safety.

Compared with traditional manual matchers, this model adopts a high-speed automatic matching algorithm, which can quickly respond to drastic changes in load impedance (such as plasma ignition stage), significantly improving process stability and production efficiency.

2、 Key technical parameters (derived from industry standards and similar products)

Based on the AMAT RF equipment technical specifications and the general parameters of the 13.56MHz frequency band matching device, the core specifications of this model are speculated as follows:

Parameter category

Specification Description

RF core characteristics

Operating frequency 13.56MHz ± 50ppm, power range 50-1500W, target impedance 50 Ω

Matching performance

Matching time<3s (preset point<1s), standing wave ratio<1.2, maximum reflected power<3W or 1% input power

Impedance matching range

Resistance component 0.5-35 Ω, reactance component -112-32 Ω (covering the typical impedance range of semiconductor plasma)

Physical and Environmental Specifications

Size approximately 370 × 264 × 130mm, weight<9kg, working temperature 0-50 ℃, humidity<85%, no condensation

Power supply and interface

220VAC ± 10% power supply, working current 0.5A; RF input is N-type female connector, control interface includes DB15 communication port

Cooling and Certification

Forced air cooling for heat dissipation, in compliance with CE, UL, and semiconductor equipment clean room usage standards

3、 Application scenarios and adaptation systems

1. Core application areas

As a power regulator for plasma technology, this matching device is mainly used in key processes of semiconductor manufacturing:

Plasma etching: a dry etching process suitable for silicon wafers and compound semiconductors, ensuring the uniformity of etching rate and pattern accuracy

Plasma enhanced chemical vapor deposition (PECVD): used for power stability control in thin film deposition process, improving film thickness consistency

Plasma cleaning: providing a stable plasma source during wafer bonding pre-processing to ensure surface cleaning effectiveness

2. Adapt devices and systems

Supporting RF power supply: Compatible with AMAT's own 1500W level RF power supply (such as the 0190 series power supply), and can also be adapted to power supplies of the same power level from brands such as Agilent and Cammed

Host device adaptation: widely used in major semiconductor equipment such as AMAT Centura etching system and Endura deposition platform

Collaborative components: linked with RF power meter and reaction chamber pressure controller to form a closed-loop power control system

 AMAT Applied Materials 0190-11570射频匹配器产品展示      

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BENTLY 136711-01 Temperature module
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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