1.产 品 资 料 介 绍：
DALSA OC-80-04K25-03 扫描相机组件产品特点
- 4K 单线阵 CCD 成像芯片，4096 有效像素，适配半导体晶圆外观精密检测
- 25kHz 标准行扫描频率，同步匹配晶圆传送高速运动，不拖影不失真
- 80μm 大感光像素尺寸，感光灵敏度高，弱光腔体环境成像清晰均匀
- 内置 TDI 积分成像模式，多阶积分提升信噪比，捕捉微小划痕颗粒缺陷
- Camera Link 标准数据接口，高速无损图像传输，适配工控图像采集卡
- 支持硬件像素合并、镜像、平场校正，一键消除画面明暗不均问题
- 集成光耦隔离触发输入，可对接预对准、伺服编码器同步取像时序
- 金属全屏蔽机身，多层 EMI 滤波，抵御刻蚀腔体射频电磁信号干扰
- M72 标准镜头接口，可搭配远心镜头，满足晶圆边缘无畸变成像需求
- 12~15V 直流宽幅供电，低功耗运行，长时间连续工作温升低
- 机身多组状态指示灯，直观显示电源、触发、数据传输、故障状态
- 0~50℃工业宽温元器件，洁净车间 7×24 小时不间断稳定采集图像
- 紧凑型一体化结构，预留标准安装孔位，可直接集成晶圆检测工位
- 配套专用调试软件，支持增益、曝光、偏移参数在线实时调节
- 低释气无尘级外壳材质，无粉尘析出，符合半导体洁净室使用规范DALSA OC-80-04K25-03 扫描相机组件为晶圆表面缺陷、边缘轮廓检测专用线阵视觉单元，成像精度高、同步性强，适配 300mm 半导体机台视觉检测系统。
DALSA OC-80-04K25-03 扫描相机组件 产品英文
DALSA OC-80-04K25-03 Scanning Camera Component Product Features
4K single line array CCD imaging chip, 4096 effective pixels, suitable for precision inspection of semiconductor wafer appearance
25kHz standard line scanning frequency, synchronized matching wafer transport high-speed motion, no dragging or distortion
80 μ m large photosensitive pixel size, high sensitivity, clear and uniform imaging in low light chamber environment
Built in TDI integral imaging mode, multi-stage integration improves signal-to-noise ratio, captures small scratch particle defects
Camera Link standard data interface, high-speed lossless image transmission, compatible with industrial control image acquisition cards
Support hardware pixel merging, mirroring, flat field correction, and one click elimination of uneven brightness and darkness in the image
Integrated optocoupler isolation trigger input, can be connected to pre alignment, servo encoder synchronous imaging timing
Metal fully shielded body, multi-layer EMI filtering, resistant to RF electromagnetic signal interference from etched cavities
M72 standard lens interface, can be paired with a telecentric lens to meet the requirement of distortion free imaging at the edge of the wafer
12-15V DC wide power supply, low-power operation, long-term continuous operation with low temperature rise
Multiple sets of status indicator lights on the body, visually displaying power, trigger, data transmission, and fault status
0~50 ℃ industrial wide temperature element device, clean room 7 × 24-hour uninterrupted stable image acquisition
Compact integrated structure, reserved standard installation holes, can be directly integrated into wafer inspection stations
Equipped with specialized debugging software, supporting real-time online adjustment of gain, exposure, and offset parameters
Low release dust-free shell material, no dust precipitation, in compliance with semiconductor cleanroom usage standards
The DALSA OC-80-04K25-03 scanning camera component is a specialized line array vision unit for detecting wafer surface defects and edge contours. It has high imaging accuracy and strong synchronization, and is suitable for 300mm semiconductor machine vision inspection systems.
DALSA OC-80-04K25-03 扫描相机组件 产品展示
视频展示
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| IC3600LDEG1B | 531X140CCHAMM2 | IC3600AOAA2 |
| IC3600LDEG1 | 531X139APMAYG2 | IC3600AOAA1D |
| IC3600LDDB1 | 531X139APMAXG2 | IC3600AOAA1A |
| IC3600LDDA1 | 531X139APMATG2 | IC3600AOAA1 |
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| IC3600LCDA1B | 531X139APMASG2 | IC3600AMLG1A |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
