1.产 品 资 料 介 绍：
Daihen SVD-121-X1784 晶圆对准仪产品特点
- 大原 DAIHEN 原厂配套，适配 300mm 半导体刻蚀沉积设备晶圆传输腔
- 高精度光学扫描传感，非接触式识别晶圆边缘与缺口标记
- 微米级定位水准，中心偏差控制≤0.08mm，角度误差 ±0.02°
- 高速对位运算程序，单次晶圆校准耗时短，提升整机生产节拍
- 真空吸附承载平台，适配硅片、石英晶圆，无背面划伤污染
- 伺服旋转模组运行平顺，抑制抖动，兼容超薄易碎裂晶圆
- Class1 洁净整机设计，低释气低发尘材质，匹配无尘车间标准
- 多路真空压力实时监测，真空泄漏自动报警，避免晶圆掉落
- 全金属屏蔽壳体，隔绝腔体射频电磁干扰，传感信号稳定无漂移
- 分体模块化结构，可单独拆卸检修，大幅缩短机台停机时长
- 同时支持缺口、平边两种晶圆基准识别，适配多规格工艺晶圆
- 标准化设备总线通讯，实时向主控传输对位偏差数据
- 密封低粉尘轴承组件，支持 7×24 小时不间断洁净车间运行
- 多组故障状态指示灯，快速区分真空、传感、电机异常故障
- 小型紧凑机身结构，适配设备传送腔狭小内置安装空间Daihen SVD-121-X1784 晶圆对准仪是 300mm 晶圆传输核心定位单元，对位精度高、洁净性能优异，保障搬运与制程稳定。
Daihen SVD-121-X1784 晶圆对准仪 产品英文
Product Features of Daihen SVD-121-X1784 Wafer Alignment Instrument
Daihara DAIHEN factory matching, compatible with 300mm semiconductor etching and deposition equipment wafer transfer cavity
High precision optical scanning sensing, non-contact recognition of wafer edges and notch markings
Micro level positioning level, center deviation control ≤ 0.08mm, angle error ± 0.02 °
High speed alignment calculation program, short single wafer calibration time, improves the overall production cycle of the machine
Vacuum adsorption bearing platform, suitable for silicon wafers and quartz wafers, without back scratches or contamination
The servo rotation module runs smoothly, suppresses shaking, and is compatible with ultra-thin and fragile wafers
Class1 clean machine design, low gas release and low dust emission material, matched with dust-free workshop standards
Real time monitoring of multiple vacuum pressures, automatic alarm for vacuum leaks, to prevent wafer dropping
All metal shielding shell, isolating cavity RF electromagnetic interference, stable sensing signal without drift
Split modular structure, can be disassembled and repaired separately, greatly reducing the downtime of the machine
Simultaneously supporting both gap and flat edge wafer benchmark recognition, suitable for multi specification process wafers
Standardized equipment bus communication, real-time transmission of alignment deviation data to the main control
Sealed low dust bearing components, supporting 7 × 24-hour uninterrupted clean workshop operation
Multiple sets of fault status indicator lights, quickly distinguish between vacuum, sensing, and motor abnormal faults
Small and compact body structure, suitable for devices with narrow transmission chambers and built-in installation space
The Daihen SVD-121-X1784 wafer alignment device is a core positioning unit for 300mm wafer transfer, with high alignment accuracy and excellent cleanliness performance, ensuring stable handling and process.
Daihen SVD-121-X1784 晶圆对准仪 产品展示
视频展示
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| IC3600LIVD1 | 531X158FFDADG1 | IC3600AOAL1D1 |
| IC3600LIVC1 | 531X157APCAMG1 | IC3600AOAL1C |
| IC3600LIVA1 | 531X156TRCABG1 | IC3600AOAL1B |
| IC3600LINB1 | 531X156TECABG1 | IC3600AOAL1 |
| IC3600LINB | 531X155TXMACG1 | IC3600AOAK1 |
| IC3600LINA1D1B | 531X155TXMABG1 | IC3600AOAJ1A |
| IC3600LINA1B | 531X149SNCADG1 | IC3600AOAJ1 |
| IC3600LINA1 | 531X149SNCABG1 | IC3600AOAH1B |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
