AMAT Applied Materials 03-81813-00印刷电路板
1.产 品 资 料 介 绍：
- 信号中转处理：接收传感器（如温度、压力传感器）信号，经滤波、放大后传输至控制器，保障数据精准性。
- 执行器驱动：输出控制信号，驱动气缸（如 3020-00121）、电磁阀等执行元件，实现设备动作控制。
- 子系统联动：连接射频互锁模块（如 0100-35565）与主控单元，传递安全联锁信号，保障设备运行安全。
- 安装：固定于设备电控板卡插槽，金手指清洁无氧化，接线端子紧固扭矩 1-1.5N・m。
- 维护：每 6 个月检查焊点无虚焊、基板无变形，每年校准板载信号放大电路精度，故障优先排查接口接触状态。
- 采购：优先选原厂供应商（如长欣自动化），到货验证基板材质报告与尺寸公差检测报告。
AMAT Applied Materials 03-81813-00印刷电路板 英文资料：
1、 Core positioning
AMAT 03-81813-00 is the "signal processing and control carrier" for semiconductor equipment, responsible for the signal reception, operation processing, and instruction issuance functions of equipment subsystems (such as sensors and actuators). It adopts high-density wiring and anti-interference design, and is suitable for Class 100 clean environments and high-frequency signal transmission scenarios.
2、 Key parameters
Category
Specifications
Substrate material
Glass fiber reinforced epoxy resin (FR-4), Tg ≥ 150 ℃
Number of wiring layers
6 layers, line width/spacing ≥ 3mil/3mil, impedance control ± 10%
Interface characteristics
Integrate 2 RS-485 channels, 4 digital I/O channels, and 2 power interfaces
Environmental adaptation
-10-60 ℃, humidity<85%, anti EMI interference (EN 61000-6-2)
Compatibility
Compatible with AMAT 0100-00985 intelligent interface board and 0225-01622 controller
3、 Core applications
Signal relay processing: Receive sensor signals (such as temperature and pressure sensors), filter and amplify them, and transmit them to the controller to ensure data accuracy.
Actuator driver: outputs control signals to drive actuators such as cylinders (such as 3020-00121) and solenoid valves, achieving device action control.
Subsystem linkage: Connect the RF interlock module (such as 0100-35565) with the main control unit, transmit safety interlock signals, and ensure the safe operation of the equipment.
4、 Key points of operation and maintenance
Installation: Fixed in the slot of the electronic control board of the equipment, with clean and oxidation free gold fingers, and a tightening torque of 1-1.5N · m for the wiring terminals
Maintenance: Check for solder joints and substrate deformation every 6 months, calibrate the accuracy of onboard signal amplification circuits annually, and prioritize troubleshooting interface contact status for faults.
Procurement: Prioritize selecting original suppliers (such as Changxin Automation), and verify the substrate material report and dimensional tolerance inspection report upon arrival.
5、 Technical value
High density wiring improves signal transmission efficiency, anti-interference design reduces environmental interference, is compatible with multiple device components, and reduces the complexity of semiconductor equipment electrical control systems.
AMAT Applied Materials 03-81813-00印刷电路板 产品展示
产品视频
3.其他产品
BENTLY 3500/92 133323-01 继电器模块
Bently 9200-01-02-02-00 振动速度传感器
ASML MC1AB37 4022.437.1856 电机控制器
4.其他英文产品
NI GPIB-140A total line expander
ABB KUC720AE01 3BHB003431R0001 3BHB000652R0001 module
EPRO MMS3120/022-000 front sensor
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
